Oh, Snap! A Fabrication Pipeline to Magnetically Connect Conventional and 3D-Printed Electronics
Oh, Snap! A Fabrication Pipeline to Magnetically Connect Conventional and 3D-Printed Electronics
复制标题
噢,卡普!
DOI:
10.1145/3411764.3445641
复制
发表时间:
2021
期刊:
影响因子:
--
通讯作者:
Max Mühlhäuser
中科院分区:
文献类型:
--
作者:
Martin Schmitz;Jan Riemann;Florian Müller;Steffen Kreis;Max Mühlhäuser
3D printing has revolutionized rapid prototyping by speeding up the creation of custom-shaped objects. With the rise of multi-material 3D printers, these custom-shaped objects can now be made interactive in a single pass through passive conductive structures. However, connecting conventional electronics to these conductive structures often still requires time-consuming manual assembly involving many wires, soldering or gluing.To alleviate these shortcomings, we propose : a fabrication pipeline and interfacing concept to magnetically connect a 3D-printed object equipped with passive sensing structures to conventional sensing electronics. To this end, utilizes ferromagnetic and conductive 3D-printed structures, printable in a single pass on standard printers. We further present a proof-of-concept capacitive sensing board that enables easy and robust magnetic assembly to quickly create interactive 3D-printed objects. We evaluate by assessing the robustness and quality of the connection and demonstrate its broad applicability by a series of example applications.
登录
查看更多内容
影响因子:
3
作者:
Jesse Burstyn;Nicholas Fellion;Paul Strohmeier;Roel Vertegaal
通讯作者:
Roel Vertegaal
DOI:
10.1145/3161165
发表时间:
2018-01
影响因子:
--
作者:
Daniel Groeger;Jürgen Steimle
通讯作者:
Daniel Groeger;Jürgen Steimle
DOI:
10.1145/2858036.2858191
发表时间:
2016
期刊:
Proceedings of the 2016 CHI Conference on Human Factors in Computing Systems
影响因子:
--
作者:
Daniel Groeger;E. C. Loo;Jürgen Steimle
通讯作者:
Jürgen Steimle
DOI:
--
发表时间:
2011
期刊:
TCHI
影响因子:
--
作者:
Z. Obrenovic;J. Martens
通讯作者:
J. Martens
DOI:
10.1145/3379337.3415863
发表时间:
2020
期刊:
The 33rd Annual ACM Symposium on User Interface Software and Technology
影响因子:
--
作者:
Haruki Takahashi;Parinya Punpongsanon;Jeeeun Kim
通讯作者:
Jeeeun Kim