The role of secreted heat shock protein-90 (Hsp90) in wound healing - how could it shape future therapeutics?
The role of secreted heat shock protein-90 (Hsp90) in wound healing - how could it shape future therapeutics?
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DOI：
10.1080/14789450.2017.1355244
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发表时间：
2017-08
影响因子：
3.4
通讯作者：
Li W
中科院分区：
文献类型：
--
作者：
Guo J;Chang C;Li W
组织修复或伤口愈合缺陷在全世界范围内造成临床、经济和社会问题。尽管进行了数十年的研究，但有效的治疗方法却很少。我们讨论生长因子治疗失败的可能原因。我们指出，缺乏与人类疾病相关的动物模型是治疗开发的另一个障碍。我们总结了最近发现的分泌型热休克蛋白 90 (Hsp90) 作为一种新型伤口愈合剂。伤口愈合是一个高度复杂的多步骤过程，需要多种细胞类型、细胞外基质和可溶性分子的参与，在伤口微环境中以空间和时间的方式协同工作。伤口保持开放的时间与伤口相关的临床死亡率直接相关。这一次的紧迫，让治愈过程根本无法恢复到未受伤的状态，反而逼得它不得不走很多捷径，才能保住生命。因此，出于治疗目的，识别伤口闭合挽救生命阶段的所谓“驱动基因”至关重要。角质形成细胞分泌的 Hsp90α 于 2007 年被发现，并通过克服阻碍生长因子在伤口愈合过程中发挥作用的几个关键障碍而展现出希望。
Defects in tissue repair or wound healing pose a clinical, economic and social problem worldwide. Despite decades of studies, there have been few effective therapeutic treatments. We discuss the possible reasons for why growth factor therapy did not succeed. We point out the lack of human disorder-relevant animal models as another blockade for therapeutic development. We summarize the recent discovery of secreted heat shock protein-90 (Hsp90) as a novel wound healing agent. Wound healing is a highly complex and multistep process that requires participations of many cell types, extracellular matrices and soluble molecules to work together in a spatial and temporal fashion within the wound microenvironment. The time that wounds remain open directly correlates with the clinical mortality associated with wounds. This time urgency makes the healing process impossible to regenerate back to the unwounded stage, rather forces it to take many shortcuts in order to protect life. Therefore, for therapeutic purpose, it is crucial to identify so-called “driver genes” for the life-saving phase of wound closure. Keratinocyte-secreted Hsp90α was discovered in 2007 and has shown the promise by overcoming several key hurdles that have blocked the effectiveness of growth factors during wound healing.
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影响因子：
4.6
作者：
Dong H;Zou M;Bhatia A;Jayaprakash P;Hofman F;Ying Q;Chen M;Woodley DT;Li W
通讯作者：
Li W
影响因子：
5.3
作者：
Cheng, Chieh-Fang;Fan, Jianhua;Li, Wei
通讯作者：
Li, Wei
影响因子：
8
作者：
Aubert, C. E.;Michel, P. -L.;Bourron, O.
通讯作者：
Bourron, O.
影响因子：
7.8
作者：
Bandyopadhyay, Balaji;Fan, Jianhua;Guan, Shengxi;Li, Yong;Chen, Mei;Woodley, David T;Li, Wei
通讯作者：
Li, Wei
影响因子：
158.5
作者：
BROWN, GL;NANNEY, LB;LYNCH, JB
通讯作者：
LYNCH, JB