In Situ Study the Electrochemical Migration of Tin under Unipolar Square Wave Electric Field
In Situ Study the Electrochemical Migration of Tin under Unipolar Square Wave Electric Field
复制标题
单极方波电场下锡电化学迁移的原位研究
DOI：
10.1149/2.014311jes
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发表时间：
2013
影响因子：
3.9
通讯作者：
Zhang, Guoan
中科院分区：
文献类型：
--
作者：
Guo, Xingpeng;Qiu, Yubing;Chen, Zhenyu;Zhang, Guoan
采用薄电解质层（TEL）法，利用光学和电化学技术研究了非稳态电场下锡的电化学迁移行为。具有各种时间周期和占空比的单极方波首先被用作用于ECM研究的非稳态电场，其中在ON时间和OFF时间期间分别在两个电极上施加3-V偏压和0-V偏压。结果表明，在关断时间期间，在两个电极上施加反向极化以确保0-V偏压。反向极化的存在将导致离子向其原始迁移方向的反向迁移，并且迁移回来的锡离子甚至可能被还原回金属锡。因此，反向极化不利于锡的电解加工。在同一时间段内，枝晶生长速率随占空比的增大而增大。而在相同的占空比下，延长时间有利于析出相的形成和枝晶的生长。提出了时间周期和占空比对电解加工行为的影响机理。
Electrochemical migration (ECM) behaviors of tin under unsteady state electric field were investigated via thin electrolyte layer (TEL) method using optical and electrochemical techniques. Unipolar square waves with various time periods and duty cycles were first used as the unsteady state electric field for ECM investigation, where a 3-V-bias and a 0-V-bias were applied across the two electrodes during the ON time and OFF time, respectively. The results show that there is a reverse polarization applied across the two electrodes during the OFF time to ensure the 0-V-bias. The presence of reverse polarization will result in ions migration reverse to their original migration direction and the tin ions that migrated back may even be reduced back to metal tin. Therefore, the reverse polarization is adverse to the ECM process of tin. At the same time period, the rate of dendrites growth increases with the increase of duty cycle. While, for the same duty cycle, the prolongation of time period is favorable for the precipitates formation and/or dendrites growth. The influence mechanisms of time period and duty cycle on ECM behaviors have also been proposed, respectively.
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影响因子：
5
作者：
F. Séby;M. Potin-Gautier;E. Giffaut;O. Donard
通讯作者：
F. Séby;M. Potin-Gautier;E. Giffaut;O. Donard
影响因子：
3.9
作者：
E. Toth-kadar;L. Péter;T. Becsei;J. Tóth;L. Pogány;T. Tarnóczi;P. Kamasa;I. Bakonyi;G. Láng-G.
通讯作者：
E. Toth-kadar;L. Péter;T. Becsei;J. Tóth;L. Pogány;T. Tarnóczi;P. Kamasa;I. Bakonyi;G. Láng-G.
影响因子：
6.6
作者：
J. Lin;T. Chang;J. H. Yang;Yi-wei Chen;C. Chuang
通讯作者：
J. Lin;T. Chang;J. H. Yang;Yi-wei Chen;C. Chuang
DOI：
10.1007/s10854-011-0435-5
发表时间：
2012-02
期刊：
Journal of Materials Science: Materials in Electronics
影响因子：
--
作者：
B. Medgyes;B. Illés;G. Harsányi
通讯作者：
B. Medgyes;B. Illés;G. Harsányi
影响因子：
4
作者：
M. Jellesen;Daniel Minzari;U. Rathinavelu;P. Møller;R. Ambat
通讯作者：
M. Jellesen;Daniel Minzari;U. Rathinavelu;P. Møller;R. Ambat