Silicon-Germanium Heterojunction Bipolar Transistors for Mm-wave Systems Technology, Modeling and Circuit Applications
Silicon-Germanium Heterojunction Bipolar Transistors for Mm-wave Systems Technology, Modeling and Circuit Applications
复制标题
用于毫米波系统技术、建模和电路应用的硅-锗异质结双极晶体管
DOI:
10.13052/rp-9788793519602
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发表时间:
2018
期刊:
影响因子:
--
通讯作者:
M. Schroter
中科院分区:
文献类型:
--
作者:
N. Rinaldi;M. Schroter
Fabrication and circuit design are linked by compact device modeling; i.e., the electrical characteristics of the devices fabricated on a wafer are represented by sufficiently simple but preferably still physics-based models that are suitable for circuit simulation and optimization. The importance of modeling has been growing rapidly due to strongly increased device complexity, manufacturing cost, and fabrication time. There is an increased demand from industry for first-pass success of high-frequency (HF) analog circuits in order to stay competitive. For SiGeC HBT technologies, ranging from production to the most advanced process, this has been successfully addressed by the standard compact bipolar transistor model HICUM/L2 [Schr10]. For practical applications, a compact model (CM) itself is not sufficient though. Its model parameters need to be determined from measurements of terminal (current, voltage) characteristics, preferably making use of clever test structures and mathematical manipulations (so-called parameter extraction methods) in order to be able to separate the various, often superimposed, physical effects and their related parameters. Consistent physics-based parameter extraction methods that provide for a given process accurate geometry-scalable and statistical device models not only represent a key enabler to first-pass design success but also yield important information for process development. One objective of DOTSEVEN was the development of
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影响因子:
5.4
作者:
U. R. Pfeiffer;Y. Zhao;J. Grzyb;R. Al Hadi;N.Sarmah;Neelanjan;W. Föster;H. Rücker;B. Heinemann
通讯作者:
B. Heinemann
DOI:
10.1109/sirf.2018.8304230
发表时间:
2018
期刊:
2018 IEEE 18th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)
影响因子:
--
作者:
M. Schröter;A. Pawlak
通讯作者:
A. Pawlak
DOI:
10.1109/tthz.2016.2602539
发表时间:
2016-11-01
影响因子:
3.2
作者:
Grzyb, Janusz;Statnikov, Konstantin;Pfeiffer, Ullrich R.
通讯作者:
Pfeiffer, Ullrich R.
影响因子:
1.1
作者:
W. Liang;A. Mukherjee;P. Sakalas;A. Pawlak;M. Schröter
通讯作者:
M. Schröter
DOI:
10.1109/bctm.2015.7340560
发表时间:
2015-12
期刊:
2015 IEEE Bipolar/BiCMOS Circuits and Technology Meeting - BCTM
影响因子:
--
作者:
A. Pawlak;S. Lehmann;P. Sakalas;J. Krause;K. Aufinger;B. Ardouin;M. Schroter
通讯作者:
A. Pawlak;S. Lehmann;P. Sakalas;J. Krause;K. Aufinger;B. Ardouin;M. Schroter