Activation-Aware Slack Assignment for Time-to-Failure Extension and Power Saving
Activation-Aware Slack Assignment for Time-to-Failure Extension and Power Saving
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用于延长故障时间和节能的激活感知裕度分配
DOI:
10.1109/tvlsi.2018.2862154
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发表时间:
2018
影响因子:
2.8
通讯作者:
Hashimoto Masanori
中科院分区:
文献类型:
--
作者:
Masuda Yutaka;Onoye Takao;Hashimoto Masanori
This paper proposes a mean time-to-failure (MTTF) aware design methodology for minimizing power dissipation while satisfying target chip lifetime. The key contributions of the proposed design methodology are to explicitly introduce MTTF as a design constraint and optimize the design with activation-aware slack assignment (ASA). Conventionally, the gates included in nonintrinsic critical paths are downscaled or replaced with high-Vth gates for power savings, where the nonintrinsic critical paths are timing paths which originally had large timing slacks before the downscaling and replacement. On the other hand, ASA gives timing slacks to nonintrinsic critical paths and reduces the number of active paths whose delays are very close to those of intrinsic critical paths whose timing slacks cannot be increased by resynthesis and sizing. The proposed optimization includes both pre-ASA circuit design and ASA implementation. The former pre-ASA design prepares several design candidates that laid out with different timing constraints and selects the most promising candidate regarding power. For this selection, every candidate is analyzed to estimate minimum supply voltage after ASA that can achieve the target MTTF. Then, the proposed methodology selects a set of flip-flops for ASA using integer linear programming, such that it reduces the sum of gatewise failure probability maximumly, and performs ASA. We evaluate MTTF of circuits with and without ASA and examine how much power saving can be obtained while satisfying the target MTTF, e.g., 10 years. Evaluation results show that the circuits with ASA achieve up to 49.6% power saving.
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DOI:
10.1109/iccad.2014.7001412
发表时间:
2014
期刊:
2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)
影响因子:
--
作者:
V. Garg
通讯作者:
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DOI:
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发表时间:
2013
期刊:
2013 IEEE International Reliability Physics Symposium (IRPS)
影响因子:
--
作者:
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通讯作者:
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DOI:
10.1109/iccad.2013.6691105
发表时间:
2013
期刊:
2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)
影响因子:
--
作者:
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通讯作者:
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影响因子:
5.4
作者:
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通讯作者:
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DOI:
10.1109/tvlsi.2010.2101089
发表时间:
2012-02-01
影响因子:
2.8
作者:
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通讯作者:
Onoye, Takao