Investigation of the threshold voltage drift in enhancement mode GaN MOSFET under negative gate bias stress

Investigation of the threshold voltage drift in enhancement mode GaN MOSFET under negative gate bias stress
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负栅极偏压应力下增强型 GaN MOSFET 阈值电压漂移的研究

DOI:
10.7567/jjap.54.044101
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发表时间:
2015-03
影响因子:
1.5
通讯作者:
Shen, Bo
Shen, Bo
中科院分区:
物理与天体物理4区
文献类型:
--
作者:
Wang, Jinyan;Hao, Yilong;Wu, Wengang;Shen, Bo

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研究了具有Al 2 O3栅介质层的栅凹槽增强型(E-mode)GaN MOSFET和耗尽型(D-mode)GaN MOS高电子迁移率晶体管(MOSHEMT)在栅偏置应力下的阈值电压漂移。在正栅应力下,两种器件的阈值电压均出现正移,而在负栅应力下,E型GaN MOSFET的阈值电压也出现正移,而D型MOSHEMT的阈值电压则出现负移。在负栅压应力作用下,器件的漏电流瞬态过程中出现了三步陷阱和去陷阱过程。有人认为,栅极电子注入和随后的陷阱中的“损坏”的栅极凹陷的GaN沟道层是占主导地位的机制,在负栅偏压下的增强型GaN MOSFET的阈值电压的正移。
Threshold voltage drift under gate bias stress was investigated in gate-recessed enhancement mode (E-mode) GaN MOSFET and depletion mode (D-mode) GaN MOS high-electron-mobility transistor (MOSHEMT) with Al2O3 gate dielectric layer. Besides the positive shift of threshold voltage in both devices under positive gate stress, it is also found that positive shift could also exist in E-mode GaN MOSFET under negative gate bias stress, while negative shift is observed in D-mode MOSHEMT. A three-step trapping and detrapping process was observed in the drain current transient of the device after negative gate bias stress. It was suggested that gate electron injection and the following trapping in the “damaged” gate recessed GaN channel layer is the dominant mechanism for the positive shift of the threshold voltage under negative gate bias in the enhancement mode GaN MOSFET.
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