Effect of the thickness of InGaN interlayer on the a-plane GaN epilayer

Effect of the thickness of InGaN interlayer on the a-plane GaN epilayer
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InGaN中间层厚度对a面GaN外延层的影响

DOI:
10.1088/1674-1056/24/2/026802
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发表时间:
2015-02
期刊:
Chin. Phys. B
影响因子:
--
通讯作者:
Yang Shao-Yan(杨少延)
Yang Shao-Yan(杨少延)
中科院分区:
其他
文献类型:
--
作者:
Wang Lian-Shan(汪连山);Zhang Qian (张谦);Meng Xiang-Yue(孟祥岳);Yang Shao-Yan(杨少延)

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本文采用a面InGaN中间层来改善a面GaN的性能。基于a-InGaN中间层,模板表现出可以获得作为柔顺效应的规则的多孔结构,以释放由a-GaN和r-蓝宝石之间的晶格和热失配引起的应变。我们发现InGaN的厚度对a-GaN的生长有很大的影响。随着InGaN中间层厚度的增加,薄膜的表面形貌和晶体质量均先改善后恶化。当InGaN厚度超过临界点时,a-GaN外延层在冷却到室温的过程中剥离。这是从蓝宝石衬底剥离a-GaN膜的有吸引力的方式。
In this paper, we use the a-plane InGaN interlayer to improve the property of a-plane GaN. Based on the a-InGaN interlayer, a template exhibits that a regular, porous structure, which acts as a compliant effect, can be obtained to release the strain caused by the lattice and thermal mismatch between a-GaN and r-sapphire. We find that the thickness of InGaN has a great influence on the growth of a-GaN. The surface morphology and crystalline quality both are first improved and then deteriorated with increasing the thickness of the InGaN interlayer. When the InGaN thickness exceeds a critical point, the a-GaN epilayer peels off in the process of cooling down to room temperature. This is an attractive way of lifting off a-GaN films from the sapphire substrate.
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