Microstructure evolution of polycrystalline Ti2AlN MAX phase film during post-deposition annealing
Microstructure evolution of polycrystalline Ti2AlN MAX phase film during post-deposition annealing
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沉积后退火过程中多晶 Ti2AlN MAX 相薄膜的微观结构演变
DOI：
10.1016/j.jeurceramsoc.2018.07.028
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发表时间：
2018-12
影响因子：
5.7
通讯作者：
Zhang Guojun
中科院分区：
文献类型：
--
作者：
Wang Tao;Chen Zhe;Wang Guoqing;Wang Lei;Zhang Guojun
在高真空中，通过对Ti-Al-N薄膜进行后退火处理，在600 °C ~ 800 °C范围内制备了Ti 2AlN MAX相多晶薄膜。研究了Ti-Al-N薄膜向多晶Ti 2AlN薄膜转变时随温度变化的微结构演变。结果表明，沉积态Ti-Al-N薄膜经600 °C以上退火后，由非晶态转变为多晶Ti 2AlN薄膜。随着退火温度从600 °C提高到700 °C，多晶Ti 2AlN薄膜的结晶度提高。在800 °C时，表层Ti 2AlN晶粒完全分解并转变为TiN相，而内层晶粒部分分解并被非晶富Al相包围。多晶Ti 2AlN薄膜的硬度最高，为34.1GPa，而非晶Ti-Al-N薄膜的硬度仅为24.2GPa。讨论了织构变化和相变的机理及其对热稳定性的影响。
Polycrystalline Ti2AlN MAX phase films were fabricated by post-deposition annealing of Ti-Al-N film at annealing temperature in the range of 600 °C–800 °C in high vacuum. The temperature-dependent microstructure evolution from Ti-Al-N film to polycrystalline Ti2AlN film has been investigated. It was found that after post-deposition annealing above 600 °C, the as-deposited amorphous Ti-Al-N film transformed to polycrystalline Ti2AlN film. With the increase of annealing temperature from 600 °C to 700 °C, the crystallinity of polycrystalline Ti2AlN film was improved. At 800 °C, the surface Ti2AlN grains completely decomposed and transformed to TiN phase while inner grains was partial decomposed and surrounded by amorphous Al-rich phase. The polycrystalline Ti2AlN film exhibited a highest hardness of 34.1 GPa while the hardness of amorphous Ti-Al-N film was only 24.2 GPa. The mechanism of texture changes and phase transformation as well as its effect on thermal stability was also discussed.
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影响因子：
3.2
作者：
T. Joelsson;A. Flink;J. Birch;L. Hultman
通讯作者：
T. Joelsson;A. Flink;J. Birch;L. Hultman
影响因子：
3.7
作者：
Zheng Zhang;Hongmei Jin;J. Chai;Lu Shen;H. L. Seng;Jisheng Pan;L. Wong;M. Sullivan;Shijie Wang
通讯作者：
Zheng Zhang;Hongmei Jin;J. Chai;Lu Shen;H. L. Seng;Jisheng Pan;L. Wong;M. Sullivan;Shijie Wang
影响因子：
4
作者：
J. Palmquist;U. Jansson;T. Seppänen;P. Persson;J. Birch;L. Hultman;P. Isberg
通讯作者：
J. Palmquist;U. Jansson;T. Seppänen;P. Persson;J. Birch;L. Hultman;P. Isberg
DOI：
10.1146/annurev.ms.03.080173.001551
发表时间：
1973-08
期刊：
Annual Review of Materials Science
影响因子：
--
作者：
G. Meyrick;G. W. Powell
通讯作者：
G. Meyrick;G. W. Powell
影响因子：
4
作者：
O. Wilhelmsson;J. Palmquist;T. Nyberg;U. Jansson
通讯作者：
O. Wilhelmsson;J. Palmquist;T. Nyberg;U. Jansson