The growth of Au/Pd/alumina/Cu–Al system studied by SRPES
The growth of Au/Pd/alumina/Cu–Al system studied by SRPES
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SRPES 研究 Au/Pd/氧化铝/Cu-Al 体系的生长
DOI：
10.1016/j.apsusc.2008.01.057
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发表时间：
2008
影响因子：
6.7
通讯作者：
V. Matolín
中科院分区：
文献类型：
--
作者：
S. Nemšák;J. Libra;T. Skála;K. Mašek;M. Škoda;M. Cabala;V. Matolín
用同步辐射光电子能谱(SRPES)、X射线光电子能谱(XPS)和低能电子衍射(LEED)研究了在Cu-9at.%Al(111)表面上生长的超薄氧化铝膜。通过对Al2p双重态的SRPES谱进行去卷积，识别出属于金属相和氧化物相的四个组分。SRPES测量证实了Pd和Au沉积过程中Pd-Au合金的形成。对系统热稳定性的研究揭示了Pd和Au原子在氧化铝层中的扩散。当Au原子在670K开始在氧化铝层下扩散时，Pd原子在此温度下形成Pd-Al表面合金。当样品加热到770K以上时，Pd原子在氧化铝中发生扩散。氧化铝层在870K加热后仍保持稳定，但其结构可能是由于金属原子的扩散而破坏的。
An ultra-thin alumina layer grown on Cu–9at.%Al (111) surface was studied using synchrotron radiation photoelectron spectroscopy (SRPES), X-ray photoelectron spectroscopy (XPS) and low energy electron diffraction (LEED). By deconvolving SRPES spectra of the Al 2p doublet, four components belonging to metallic as well as oxide phases were recognized. Pd–Au alloy formation was confirmed by SRPES measurement during Pd and Au deposition. The study of the system's thermal stability reveals diffusion of Pd and Au atoms through the alumina layer. While Au atoms start to diffuse under the alumina layer at 670K, Pd atoms are forming Pd–Al surface alloy at this temperature. The diffusion of Pd atoms through alumina occurs when sample was heated over 770K. Alumina layer was stable even after heating the sample at 870K, but its structure was corrupted probably due to the diffusion of metal atoms.
外延生长氧化铝薄膜的界面终止和能带排列
DOI：
--
发表时间：
2008
期刊：
J.Appl.Phys. 103
影响因子：
--
作者：
M. Yoshitake;W. Song;et. al.
通讯作者：
et. al.
超薄%20Oxide%20Layer%20Formation%20on%20Cu-9%Al(111)%20Surface%20and%20Pd%20Growth%20Study%20by%20RHEED%20and%20AES
DOI：
--
发表时间：
2005
期刊：
影响因子：
--
作者：
M.Yoshitake,W.Song;V.Matolin;J.Libra;K.Masek;F.Sutara;K.C.Prince;M.Yoshitake and W.Song;W.Song and M.Yoshitake;S.Nemsak,M.Yoshitake,K.Masek
通讯作者：
S.Nemsak,M.Yoshitake,K.Masek
NiAl(110)上单步氧化外延生长有序超薄Al2O3薄膜
DOI：
--
发表时间：
2005
期刊：
Appl.Surf.Sci., 239
影响因子：
--
作者：
Zhaoyang Wang;Hiroyasu Sone;Yasuhide Tsuji;Masaaki Imai;Shinya Sato;T.T.Lay,M.Yoshitake and W.Song
通讯作者：
T.T.Lay,M.Yoshitake and W.Song