A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging.

A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging.
复制标题

基于三维圆片级封装的高Q双质量MEMS音叉陀螺。

DOI:
10.3390/s21196428
复制
发表时间:
2021-09-26
期刊:
Sensors (Basel, Switzerland)
影响因子:
--
通讯作者:
Yang F
Yang F
中科院分区:
其他
文献类型:
--
作者:
Xu P;Si C;He Y;Wei Z;Jia L;Han G;Ning J;Yang F

文献摘要

参考文献

被引文献

相似文献

音叉陀螺仪(TFGs)具有潜在的高精度应用前景。这项工作提出并实验证明了一种新型的高q双质量音叉微机电系统(MEMS)陀螺仪利用三维(3D)封装技术。除了两个具有同步结构的对称解耦证明质量外,还设计了一个对称解耦杠杆结构来强制反平行、反相位驱动模式运动并消除低频杂散模式。通过线性耦合、动量和转矩平衡的反相检测模式,大大降低了热弹性阻尼(TED)和锚损。此外,采用新颖的三维封装技术实现了高q因子。通过硅通孔(TSV)和硅中玻璃(GIS)回流工艺制造的复合衬底封装帽与晶圆级传感结构阳极结合。采用自主开发的控制电路实现回路控制和陀螺仪性能表征。结果表明,采用这种3D封装技术可以实现高可靠性的电气连接和高气密性的封装。驱动模式和感知模式的q因子分别高达51,947和49,249。该TFG实现了±1800°/s的宽测量范围和0.1°/s的高分辨率,自动模式匹配后的比例因子非线性为720 ppm。此外,温度补偿可以有效抑制长期零利率输出(ZRO)漂移,产生0.923°/√h的小角度随机游走(ARW)和9.270°/h的低偏置不稳定性(BI)。
Tuning fork gyroscopes (TFGs) are promising for potential high-precision applications. This work proposes and experimentally demonstrates a novel high-Q dual-mass tuning fork microelectromechanical system (MEMS) gyroscope utilizing three-dimensional (3D) packaging techniques. Except for two symmetrically decoupled proof masses (PM) with synchronization structures, a symmetrically decoupled lever structure is designed to force the antiparallel, antiphase drive mode motion and eliminate low frequency spurious modes. Thermoelastic damping (TED) and anchor loss are greatly reduced by the linearly coupled, momentum- and torque-balanced antiphase sense mode. Moreover, a novel 3D packaging technique is used to realize high Q-factors. A composite substrate encapsulation cap, fabricated by through-silicon-via (TSV) and glass-in-silicon (GIS) reflow processes, is anodically bonded to the wafer-scale sensing structures. A self-developed control circuit is adopted to realize loop control and characterize gyroscope performances. It is shown that a high-reliability electrical connection, together with a high air impermeability package, can be fulfilled with this 3D packaging technique. Furthermore, the Q-factors of the drive and sense modes reach up to 51,947 and 49,249, respectively. This TFG realizes a wide measurement range of ±1800 °/s and a high resolution of 0.1°/s with a scale factor nonlinearity of 720 ppm after automatic mode matching. In addition, long-term zero-rate output (ZRO) drift can be effectively suppressed by temperature compensation, inducing a small angle random walk (ARW) of 0.923°/√h and a low bias instability (BI) of 9.270°/h.
DOI: 10.1109/jsen.2009.2026466
发表时间: 2009-12-01
影响因子: 4.3
作者:
Acar, Cenk;Schofield, Adam R.;Shkel, Andrei M.
通讯作者: Shkel, Andrei M.
DOI: 10.3390/s140713024
发表时间: 2014-07-21
期刊: Sensors (Basel, Switzerland)
影响因子: --
作者:
Ni Y;Li H;Huang L;Ding X;Wang H
通讯作者: Wang H
DOI: 10.3390/mi12050506
发表时间: 2021-04-30
期刊: Micromachines
影响因子: 3.4
作者:
Xu P;Wei Z;Guo Z;Jia L;Han G;Si C;Ning J;Yang F
通讯作者: Yang F
DOI: 10.3390/s19010093
发表时间: 2019-01-01
期刊: SENSORS
影响因子: 3.9
作者:
Zhang, Meng;Yang, Jian;Ning, Jin
通讯作者: Ning, Jin
DOI: 10.3390/s150511222
发表时间: 2015-05-13
期刊: Sensors (Basel, Switzerland)
影响因子: --
作者:
Feng Y;Li X;Zhang X
通讯作者: Zhang X