Abrasive-assisted Nickel Electroforming Process with Moving Cathode
Abrasive-assisted Nickel Electroforming Process with Moving Cathode
复制标题
移动阴极磨料辅助镍电铸工艺
DOI：
10.1007/s10033-017-0078-4
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发表时间：
2017-03
期刊：
影响因子：
--
通讯作者：
Zhu Di
中科院分区：
文献类型：
--
作者：
Ren Jianhua;Zhu Zengwei;Xia Chunqiu;Qu Ningsong;Zhu Di
传统的复杂型面回转体电铸工艺中，沉积物表面存在的针孔、结节等缺陷会导致电铸件不同部位的物理机械性能存在差异。针对这一问题，采用复合移动阴极进行复杂轮廓回转件磨料辅助电铸加工。阴极同时平移和旋转，以实现对沉积物的均匀摩擦效果，没有任何缺点。研究了电流密度和平移速度对电铸镍层微观结构和性能的影响。研究发现，复合阴极运动磨料辅助电铸能有效去除针孔和结节，积极影响晶体成核，细化层状晶粒。电流密度的增加将导致显微组织粗化，显微硬度降低，从325 HV降至189 HV。同时，更快的平移线速度可产生更好的表面质量和更高的显微硬度（从 236 HV 到 283 HV）。通过对镍层与304不锈钢焊接接头的金相分析，研究了电铸层的焊接性能。电沉积镍层表现出良好的焊接性能。阴极的新型复合运动提高了机械性能并细化了沉积层的微观结构。
In traditional electroforming process for revolving parts with complex profiles, the drawbacks on surface of deposits, such as pinholes and nodules, will lead to varying physical and mechanical properties on different parts of electroformed components. To solve the problem, compositely moving cathode is employed in abrasive-assisted electroforming of revolving parts with complicated profiles. The cathode translates and rotates simultaneously to achieve uniform friction effect on deposits without drawbacks. The influences of current density and translation speed on the microstructure and properties of the electroformed nickel layers are investigated. It is found that abrasive-assisted electroforming with compound cathode motion can effectively remove the pinholes and nodules, positively affect the crystal nucleation, and refine the grains of layer. The increase of current density will lead to coarse microstructure and lower micro hardness, from 325 HV down to 189 HV. While, faster translational linear speed produces better surface quality and higher micro hardness, from 236 HV up to 283 HV. The weld-ability of the electroformed layers are also studied through the metallurgical analysis of welded joints between nickel layer and 304 stainless steel. The electrodeposited nickel layer shows fine performance in welding. The novel compound motion of cathode promotes the mechanical properties and refines the microstructure of deposited layer.
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DOI：
--
发表时间：
1977-07
期刊：
--
影响因子：
--
作者：
J. Dini;H. R. Johnson
通讯作者：
J. Dini;H. R. Johnson
DOI：
10.1016/s0007-8506(07)60396-5
发表时间：
2006
期刊：
CIRP Annals
影响因子：
--
作者：
Di Zhu;Zengwei Zhu;N. Qu
通讯作者：
Di Zhu;Zengwei Zhu;N. Qu
影响因子：
4.8
作者：
Z. Zhong
通讯作者：
Z. Zhong
DOI：
--
发表时间：
1979-12
期刊：
--
影响因子：
--
作者：
J. Brooks;J. Dini;H. R. Johnson
通讯作者：
J. Brooks;J. Dini;H. R. Johnson
影响因子：
3
作者：
Ming‐Shyan Huang;H. Ku
通讯作者：
Ming‐Shyan Huang;H. Ku