Fine hole drilling of alkali-containing silicate glass substrate using preferential penetration of etchants around silver precipitates
Fine hole drilling of alkali-containing silicate glass substrate using preferential penetration of etchants around silver precipitates
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利用银沉淀物周围蚀刻剂的优先渗透对含碱硅酸盐玻璃基板进行细孔钻孔
DOI：
10.1016/j.precisioneng.2022.03.017
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发表时间：
2022
期刊：
影响因子：
--
通讯作者：
Morita Noboru
中科院分区：
文献类型：
--
作者：
Kawamura Hirofumi;Okuda Riku;Matsusaka Souta;Nomoto Kentaro;Kodaka Hiroki;Hidai Hirofumi;Chiba Akira;Morita Noboru
固态离子交换是一种用于含碱玻璃材料的金属掺杂方法。当一个额外的电压施加到银掺杂玻璃表面时，它在掺杂区域产生纳米尺寸的枝晶沉淀。银的析出伴随着裂纹的形成，导致玻璃衬底形成网状微裂纹。这些裂纹网络可以作为蚀刻剂在去除过程中的渗透路径。在本研究中，我们评估了蚀刻条件对银沉淀区和非银沉淀区溶解特性的影响。此外，还进行了高纵横比的玻璃精孔钻削。当使用氢氟酸作为蚀刻剂时，这些区域的蚀刻速率随蚀刻剂温度和浓度的增加而增加。而蚀刻速率比（银沉淀区与非银沉淀区的蚀刻速率）没有明显变化。同样，在氢氧化钾溶液中，蚀刻剂浓度对蚀刻速率比的影响较小。而在KOH溶液中蚀刻速率比在HF溶液中高出3倍以上。说明KOH溶液适合优先去除银沉淀区。此外，利用图案镀银膜作为银离子源，对玻璃基板进行了细孔钻孔。因此，成功地形成了玻璃通孔阵列。
Solid-state ion exchange is a metal doping method used for alkali-containing glass materials. When an additional voltage is applied to the silver-doped glass surface, it yields nanometer-sized dendritic precipitates in the doped area. The silver precipitation is accompanied by crack formation, which causes the formation of a network of micro-cracks in the glass substrate. These crack networks can be a penetration path for the etchants in removal processes. In this study, we evaluated the effect of etching conditions on the dissolution characteristics of silver-precipitated and un-precipitated areas. Furthermore, fine hole drilling of glass with a higher aspect ratio was performed. When hydrofluoric (HF) acid was used as an etchant, the etching rate of these areas increased with an increase in the etchant temperature and concentration. However, there was no significant change in the etching rate ratio (etching rate of silver-precipitated area per that of un-precipitated area). Similarly, the effect of the etchant concentration on the etching rate ratio was small in the case of potassium hydroxide (KOH) solution. However, the etching rate ratio in the KOH solution was more than three times higher than that of the HF solution. This demonstrates that the KOH solution was suitable for the preferential removal of the silver-precipitated area. Additionally, fine hole drilling of the glass substrate was performed using patterned silver plating film as a silver ion source. Consequently, through-glass hole array was successfully formed.
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影响因子：
7.4
作者：
Allen PB;Chiu DT
通讯作者：
Chiu DT
DOI：
10.1016/j.precisioneng.2020.03.016
发表时间：
2020-07
影响因子：
3.6
作者：
Hirofumi Kawamura;S. Matsusaka;K. Nomoto;H. Kodaka;H. Hidai;A. Chiba;N. Morita
通讯作者：
Hirofumi Kawamura;S. Matsusaka;K. Nomoto;H. Kodaka;H. Hidai;A. Chiba;N. Morita
通过施加正向/反向电压的固态离子交换在玻璃基板中形成嵌入式电路
DOI：
10.1016/j.precisioneng.2018.09.011
发表时间：
2019
期刊：
Precision Engineering
影响因子：
--
作者：
Hirofumi Kawamura;Ryuta X. Suzuki;S. Matsusaka;H. Hidai;A. Chiba;N. Morita
通讯作者：
N. Morita
电场辅助固态离子交换在硼硅酸盐玻璃中形成多层导电路径
影响因子：
--
作者：
Ryuta X. Suzuki;Hirofumi Kawamura;S. Matsusaka;H. Hidai;A. Chiba;N. Morita
通讯作者：
N. Morita
平面埋入式离子交换玻璃波导：扩散特性
影响因子：
2.5
作者：
R. Ramaswamy;S. Najafi
通讯作者：
S. Najafi