Calcium-assisted glass-to-glass bonding for fabrication of glass microfluidic devices.
Calcium-assisted glass-to-glass bonding for fabrication of glass microfluidic devices.
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DOI：
10.1021/ac801059h
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发表时间：
2008-09-15
影响因子：
7.4
通讯作者：
Chiu DT
中科院分区：
文献类型：
--
作者：
Allen PB;Chiu DT
玻璃是许多微流体应用所需的材料。它具有耐化学性，并具有毛细管电泳所需的特性。然而，制造玻璃芯片的过程冗长且不方便，其中最困难的步骤通常是将两个平面玻璃基板结合。在这里，我们描述了一种新的玻璃键合技术，该技术只需要用钙溶液清洗玻璃表面，并在115 °C下键合1-2小时。我们发现钙独特地允许这种简单而有效的低温键合发生，而我们尝试的其他阳离子（例如，Na+、Mg ~（2+）、Mn ~（3+）等离子对复合材料的结合效果良好。我们确定这种键能够承受至少高达4 kV · cm−1的高场强。当对流体入口施加强压力时，孔下方的盖玻片的圆形部分向外爆炸，但玻璃-玻璃界面的脱粘非常少。结合使用聚二甲基硅氧烷（PDMS）蚀刻引导件对玻璃基板进行的定向氢氟酸蚀刻，我们能够在6小时内以高于90%的产率制造玻璃芯片。该技术与廉价的未抛光玻璃兼容，并且分辨率受限于所使用的PDMS蚀刻引导件和各向同性蚀刻的固有特性。
Glass is a desired material for many microfluidics applications. It is chemically resistant and has desirable characteristics for capillary electrophoresis. The process to make a glass chip, however, is lengthy and inconvenient, with the most difficult step often being the bonding of two planar glass substrates. Here we describe a new glass bonding technique, which requires only washing of the glass surfaces with a calcium solution and 1–2 h of bonding at 115 °C. We found calcium uniquely allows for this simple and efficient low-temperature bonding to occur, and none of the other cations we tried (e.g., Na+, Mg2+, Mn3+) resulted in satisfactory bonding. We determined this bond is able to withstand high applied field strengths of at least up to 4 kV · cm−1. When intense pressure was applied to a fluid inlet, a circular portion of the coverslip beneath the well exploded outward but very little of the glass–glass interface debonded. In combination with the directed hydrofluoric acid etching of a glass substrate using a poly(dimethylsiloxane) (PDMS) etch guide, we were able to make glass chips with better than 90% yield within 6 h. This technique is compatible with inexpensive unpolished glass and is limited in resolution by the PDMS etch guide used and the intrinsic properties of isotropic etching.
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影响因子：
8.4
作者：
Chiem, N;Lockyear-Shultz, L;Harrison, DJ
通讯作者：
Harrison, DJ
影响因子：
7.4
作者：
Jia, ZJ;Fang, Q;Fang, ZL
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影响因子：
6.1
作者：
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通讯作者：
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影响因子：
8.4
作者：
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通讯作者：
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影响因子：
7.4
作者：
Allen, Peter B.;Doepker, Byron R.;Chiu, Daniel T.
通讯作者：
Chiu, Daniel T.