Long term stability of c-Si surface passivation using corona charged SiO 2
Long term stability of c-Si surface passivation using corona charged SiO 2
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使用电晕充电 SiO 2 进行 c-Si 表面钝化的长期稳定性
DOI:
10.1016/j.apsusc.2017.03.204
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发表时间:
2017
影响因子:
6.7
通讯作者:
Bonilla R
中科院分区:
文献类型:
--
作者:
Bonilla R
Recombination at the semiconductor surface continues to be a major limit to optoelectronic device performance, in particular for solar cells. Passivation films reduce surface recombination by a combination of chemical and electric field effect components. Dielectric films used for this purpose, however, must also accomplish optical functions at the cell surface. In this paper, corona charge is seen as a potential method to enhance the passivation properties of a dielectric film while maintaining its optical characteristics. It is observed that corona charge can produce extreme reductions in surface recombination via field effect, in the best case leading to lifetimes exceeding 5 ms at an injection of 1015cm−3. For a 200 μm n-type 1 Ω cm c-Si wafer, this equates to surface recombination velocities below 0.65 cm/s andJ0evalues of 0.92 fA/cm2. The average improvement in passivation after corona charging gave lifetimes of 1–3 ms. This was stabilised for a period of 3 years by chemically treating the films to prevent water absorption. Surface recombination was kept below 7 cm/s, andJ0e< 16.28 fA/cm2for 3 years, with a decay time constant of 8.7 years. Simulations of back-contacted n-type cells show that front surface recombination represents less than 2% of the total internally generated power in the cell (the loss in power output) when the passivation is kept better than 16 fA/cm2, and as high as 10% if front recombination is worse than 100 fA/cm2.
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影响因子:
3.2
作者:
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通讯作者:
McIntosh, Keith R.
影响因子:
3.2
作者:
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通讯作者:
Klaus F. Schuegrafa;C. Hu
DOI:
--
发表时间:
2010
期刊:
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--
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通讯作者:
Hui Yang
DOI:
10.4028/www.scientific.net/ssp.242.73
发表时间:
2015
期刊:
Solid State Phenomena
影响因子:
--
作者:
Bonilla R
通讯作者:
Bonilla R
DOI:
10.1016/j.egypro.2016.07.090
发表时间:
2016
期刊:
Energy Procedia
影响因子:
--
作者:
R. S. Bonilla;N. Jennison;D. Clayton;Katherine A. Collett;L. Rands;P. Wilshaw
通讯作者:
P. Wilshaw