Antibiotics-Free Compounds for Chronic Wound Healing.
Antibiotics-Free Compounds for Chronic Wound Healing.
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DOI:
10.3390/pharmaceutics14051021
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发表时间:
2022-05-09
期刊:
影响因子:
5.4
通讯作者:
Liu, Lian X.
中科院分区:
文献类型:
--
作者:
Oluwole, David O.;Coleman, Lucy;Buchanan, William;Chen, Tao;La Ragione, Roberto M.;Liu, Lian X.
The rapid rise in the health burden associated with chronic wounds is of great concern to policymakers, academia, and industry. This could be attributed to the devastating implications of this condition, and specifically, chronic wounds which have been linked to invasive microbial infections affecting patients’ quality of life. Unfortunately, antibiotics are not always helpful due to their poor penetration of bacterial biofilms and the emergence of antimicrobial resistance. Hence, there is an urgent need to explore antibiotics-free compounds/formulations with proven or potential antimicrobial, anti-inflammatory, antioxidant, and wound healing efficacy. The mechanism of antibiotics-free compounds is thought to include the disruption of the bacteria cell structure, preventing cell division, membrane porins, motility, and the formation of a biofilm. Furthermore, some of these compounds foster tissue regeneration by modulating growth factor expression. In this review article, the focus is placed on a number of non-antibiotic compounds possessing some of the aforementioned pharmacological and physiological activities. Specific interest is given to Aloe vera, curcumin, cinnamaldehyde, polyhexanide, retinoids, ascorbate, tocochromanols, and chitosan. These compounds (when alone or in formulation with other biologically active molecules) could be a dependable alternative in the management or prevention of chronic wounds.
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影响因子:
3.4
作者:
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通讯作者:
Baldrick, Paul
影响因子:
5.8
作者:
Anand, Preetha;Nair, Hareesh B.;Sung, Bokyung;Kunnumakkara, Ajaikumar B.;Yadav, Vivek R.;Tekmal, Rajeshwar R.;Aggarwal, Bharat B.
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影响因子:
6.5
作者:
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DOI:
10.7241/ourd.20174.108
发表时间:
2017-01-01
期刊:
Our Dermatology Online
影响因子:
--
作者:
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通讯作者:
Maheshwari, V.
影响因子:
1.9
作者:
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通讯作者:
van Gent, M.