Experimental evaluation of an adaptive Joule-Thomson cooling system including silicon-microfabricated heat exchanger and microvalve components.
Experimental evaluation of an adaptive Joule-Thomson cooling system including silicon-microfabricated heat exchanger and microvalve components.
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DOI：
10.1116/1.3545917
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发表时间：
2011-03-01
期刊：
影响因子：
--
通讯作者：
Gianchandani YB
中科院分区：
文献类型：
--
作者：
Zhu W;Park JM;White MJ;Nellis GF;Gianchandani YB
本文报道了一种焦耳-汤姆逊（JT）冷却系统的评估，该系统结合了两个定制的微机械组件——硅/玻璃堆回热式热交换器和压电驱动的膨胀微阀。随着微阀控制流量，该系统可以调节冷却，以适应不同的制冷负荷。多孔板硅/玻璃热交换器是由一堆交替的硅板和耐热玻璃垫片制成的。该微阀利用锆钛酸铅致动器将硅微机械阀座推到玻璃板上，从而调节通过阀座和玻璃板之间间隙的流量。所制备的热交换器占地面积为1 × 1 cm2，长度为35 mm。微机械压电驱动阀的尺寸约为1 × 1 × 1 cm3。在JT冷却试验中，通过调节微阀的输入电压，成功地控制了系统温度。当阀门全开（输入电压为−30 V）时，系统在稳态进出口压差430 kPa下温度降至254.5 K，在瞬态710 kPa下温度降至234 K。该系统在255k时提供75mw的冷却功率，在258k时提供150mw的冷却功率。255k时的寄生热负荷估计约为700mw。
This article reports the evaluation of a Joule–Thomson (JT) cooling system that combines two custom micromachined components—a Si/glass-stack recuperative heat exchanger and a piezoelectrically actuated expansion microvalve. With the microvalve controlling the flow rate, this system can modulate cooling to accommodate varying refrigeration loads. The perforated plate Si/glass heat exchanger is fabricated with a stack of alternating silicon plates and Pyrex glass spacers. The microvalve utilizes a lead zirconate titanate actuator to push a Si micromachined valve seat against a glass plate, thus modulating the flow passing through the gap between the valve seat and the glass plate. The fabricated heat exchanger has a footprint of 1 × 1 cm2 and a length of 35 mm. The size of the micromachined piezoelectrically actuated valve is about 1 × 1 × 1 cm3. In JT cooling tests, the temperature of the system was successfully controlled by adjusting the input voltage of the microvalve. When the valve was fully opened (at an input voltage of −30 V), the system cooled down to a temperature as low as 254.5 K at 430 kPa pressure difference between inlet and outlet at steady state and 234 K at 710 kPa in a transient state. The system provided cooling powers of 75 mW at 255 K and 150 mW at 258 K. Parasitic heat loads at 255 K are estimated at approximately 700 mW.
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影响因子：
3.1
作者：
TERRY, SC;JERMAN, JH;ANGELL, JB
通讯作者：
ANGELL, JB
影响因子：
2.7
作者：
Collier, J;Wroblewski, D;Bifano, T
通讯作者：
Bifano, T
影响因子：
2.7
作者：
Rich, CA;Wise, KD
通讯作者：
Wise, KD
DOI：
10.1088/0960-1317/18/1/015023
发表时间：
2008-01-01
影响因子：
2.3
作者：
Park, Jong M.;Taylor, Ryan P.;Gianchandani, Yogesh B.
通讯作者：
Gianchandani, Yogesh B.
影响因子：
2.1
作者：
ter Brake, HJM;Wiegerinck, GFM
通讯作者：
Wiegerinck, GFM