Physiological and transcriptional analyses of induced post-anthesis thermo-tolerance by heat-shock pretreatment on germinating seeds of winter wheat
Physiological and transcriptional analyses of induced post-anthesis thermo-tolerance by heat-shock pretreatment on germinating seeds of winter wheat
复制标题
热激预处理诱导冬小麦发芽种子花后耐热性的生理和转录分析
DOI:
10.1016/j.envexpbot.2016.08.002
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发表时间:
2016-11
影响因子:
5.7
通讯作者:
Jiang Dong
中科院分区:
文献类型:
--
作者:
Zhang Xiaxiang;Zhou Qin;Wang Xiao;Cai Jian;Dai Tingbo;Cao Weixing;Jiang Dong
Heat stress occurring during grain filling is a worldwide environmental constraint limiting wheat production. To evaluate the alleviation effects of heat-shock pretreatment during germination on post-anthesis heat stress, germinating seeds were firstly heat-shocked at 40 °C for four hours. The plants were later given a five-day high temperature stress from ten days after anthesis. The post-anthesis heat stress resulted in significant grain yield reduction. However, the heat-shock pretreatment caused less yield loss. Physiological analyses revealed that capacities of leaf photosynthesis and antioxidation were improved to benefit the less yield loss in the pretreated plants. This was consistent with the differentially regulated expressions of the involving genes as revealed by the transcriptomic analysis. In addition, the transcriptome profiling indicated that the stress signaling processes were triggered, and expressions of stress related genes such as heat-shock proteins and osmotins were up-regulated in the pretreated plants. Thus, the up-regulated physiological processes of photosynthesis, antioxidation and HSPs accumulation because of the modified expressions of the related genes could contribute to the enhanced thermo-tolerance induced by heat-shock pretreatment.
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影响因子:
14.9
作者:
Tanz SK;Castleden I;Hooper CM;Vacher M;Small I;Millar HA
通讯作者:
Millar HA
影响因子:
7.4
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Mariano Cossani, C.;Reynolds, Matthew P.
通讯作者:
Reynolds, Matthew P.
影响因子:
2
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3.5
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Lidon, F. C.
影响因子:
7.4
作者:
Ainsworth, Elizabeth A.;Ort, Donald R.
通讯作者:
Ort, Donald R.