The ferritin superfamily: Supramolecular templates for materials synthesis.
The ferritin superfamily: Supramolecular templates for materials synthesis.
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DOI：
10.1016/j.bbagen.2009.12.005
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发表时间：
2010-08
期刊：
影响因子：
--
通讯作者：
Douglas T
中科院分区：
文献类型：
--
作者：
Uchida M;Kang S;Reichhardt C;Harlen K;Douglas T
铁蛋白超家族的成员是具有中空内腔的多亚基笼状蛋白。这些蛋白质具有三个不同的表面，即笼的内表面和外表面以及亚基之间的界面。内腔提供了独特的反应环境，其中内部反应与外部环境分离。在生物学中，空腔用于铁的螯合和生物矿化，作为使铁惰性并将其从外部环境中螯合的机制。材料科学家受到该系统的启发，并利用一系列铁蛋白超家族蛋白作为超分子模板来封装纳米颗粒和/或作为用于制造更高阶组装的明确定义的构建块。除了内腔，蛋白质笼的外表面可以被修饰而不改变内部特征。这使我们能够将蛋白质笼递送到体内靶组织，或者在固体基质上实现受控组装以制造更高阶的结构。此外，亚基之间的界面被用于操纵蛋白质笼的嵌合自组装，并在生成的非破坏性Janus颗粒。利用这些想法，铁蛋白超家族已被用于开发从生物医学到电子学的广泛应用的材料。
Members of the ferritin superfamily are multi-subunit cage-like proteins with a hollow interior cavity. These proteins possess three distinct surfaces, i.e. interior and exterior surfaces of the cages and interface between subunits. The interior cavity provides a unique reaction environment in which the interior reaction is separated from the external environment. In biology the cavity is utilized for sequestration of irons and biomineralization as a mechanism to render Fe inert and sequester it from the external environment. Material scientists have been inspired by this system and exploited a range of ferritin superfamily proteins as supramolecular templates to encapsulate nanoparticles and/or as well-defined building blocks for fabrication of higher order assembly. Besides the interior cavity, the exterior surface of the protein cages can be modified without altering the interior characteristics. This allows us to deliver the protein cages to a targeted tissue in vivo or to achieve controlled assembly on a solid substrate to fabricate higher order structures. Furthermore, the interface between subunits is utilized for manipulating chimeric self-assembly of the protein cages and in the generation of symmetry-broken Janus particles. Utilizing these ideas, the ferritin superfamily has been exploited for development of a broad range of materials with applications from biomedicine to electronics.
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影响因子：
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作者：
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