Voltage-sensitive dye imaging reveals improved topographic activation of cortex in response to manipulation of thalamic microstimulation parameters.
Voltage-sensitive dye imaging reveals improved topographic activation of cortex in response to manipulation of thalamic microstimulation parameters.
复制标题
DOI:
10.1088/1741-2560/9/2/026008
复制
发表时间:
2012-04
影响因子:
4
通讯作者:
Stanley GB
中科院分区:
文献类型:
--
作者:
Wang Q;Millard DC;Zheng HJ;Stanley GB
Voltage sensitive dye (VSD) imaging was used to quantify in-vivo, network level spatiotemporal cortical activation in response to electrical microstimulation of the thalamus in the rat vibrissa pathway. Thalamic microstimulation evoked a distinctly different cortical response than natural sensory stimulation, with the response to microstimulation spreading over a larger area of cortex and being topographically misaligned with the cortical column to which the stimulated thalamic region projects. Electrical stimulation with cathode-leading asymmetric waveforms reduced this topographic misalignment while simultaneously increasing the spatial specificity of the cortical activation. Systematically increasing the asymmetry of the microstimulation pulses revealed a continuum between symmetric and asymmetric stimulation that gradually reduced the topographic bias. These data strongly support the hypothesis that manipulation of the electrical stimulation waveform can be used to selectively activate specific neural elements. Specifically, our results are consistent with the prediction that cathode-leading asymmetric waveforms preferentially stimulating cell bodies over axons, while symmetric waveforms preferentially activate axons over cell bodies. The findings here provide some initial steps toward the design and optimization of microstimulation of neural circuitry, and open the door to more sophisticated engineering tools, such as nonlinear system identification techniques, to develop technologies for more effective control of activity in the nervous system.
登录
查看更多内容
影响因子:
1.8
作者:
Humayun, MS;Weiland, JD;de Juan, E
通讯作者:
de Juan, E
影响因子:
7.7
作者:
LaLumiere, Ryan T.
通讯作者:
LaLumiere, Ryan T.
影响因子:
25
作者:
Boyden, ES;Zhang, F;Deisseroth, K
通讯作者:
Deisseroth, K
影响因子:
25
作者:
Logothetis, Nikos K.;Augath, Mark;Merkle, Hellmut
通讯作者:
Merkle, Hellmut
影响因子:
2.4
作者:
Civillico, EF;Contreras, D
通讯作者:
Contreras, D