Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology

Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology
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采用嵌入式晶圆级 BGA 封装技术的工业毫米波雷达传感器

DOI:
10.1109/jsen.2016.2587731
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发表时间:
2016
影响因子:
4.3
通讯作者:
D. Kissinger
D. Kissinger
中科院分区:
综合性期刊2区
文献类型:
--
作者:
C. Beck;H. Ng;R. Agethen;M. PourMousavi;H. Forstner;M. Wojnowski;K. Pressel;R. Weigel;A. Hagelauer;D. Kissinger

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我们为工业传感器应用提供高度集成的60 ghz雷达收发器。双基地和单基地收发器采用SiGe双极技术实现,并使用嵌入式晶圆级球栅阵列技术进行封装,该技术允许将天线直接嵌入封装再分配层中。通过这种方式,包含所有毫米波组件的非常紧凑和高效的雷达前端可以在8 × 8 mm2封装中实现。这些前端焊接在基于FR4材料的标准低成本印刷电路板上。为了验证所提出的前端,本文开发并建立了调频连续波(FMCW)雷达系统。对所设计的系统进行了理论分析和仿真,并进行了相应的测量。这些嵌入式雷达传感器的演示结果表明,在高集成度的情况下,系统性能优异。
We present highly integrated 60-GHz radar transceivers for industrial sensor applications. The bistatic and monostatic transceivers are implemented in the SiGe bipolar technology and packaged using the embedded wafer-level ball grid array technology that allows for direct embedding of the antennas in the package redistribution layer. In this way, very compact and efficient radar frontends comprising all millimeterwave components can be implemented in an 8 × 8 mm2 package. These frontends were soldered on a standard low-cost printed circuit board based on FR4 material. For verification of the proposed frontends, an frequency-modulated continuous wave (FMCW) radar system was developed and set up within this paper. Theoretical considerations and simulations as well as corresponding measurements were carried out for the evaluation of the designed system. The demonstrator results of these embedded radar sensors show an excellent system performance at a high integration level.
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发表时间: 2013
影响因子: 4.3
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通讯作者: D. Kissinger
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影响因子: 4.3
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