Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology
Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology
复制标题
采用嵌入式晶圆级 BGA 封装技术的工业毫米波雷达传感器
DOI:
10.1109/jsen.2016.2587731
复制
发表时间:
2016
影响因子:
4.3
通讯作者:
D. Kissinger
中科院分区:
文献类型:
--
作者:
C. Beck;H. Ng;R. Agethen;M. PourMousavi;H. Forstner;M. Wojnowski;K. Pressel;R. Weigel;A. Hagelauer;D. Kissinger
We present highly integrated 60-GHz radar transceivers for industrial sensor applications. The bistatic and monostatic transceivers are implemented in the SiGe bipolar technology and packaged using the embedded wafer-level ball grid array technology that allows for direct embedding of the antennas in the package redistribution layer. In this way, very compact and efficient radar frontends comprising all millimeterwave components can be implemented in an 8 × 8 mm2 package. These frontends were soldered on a standard low-cost printed circuit board based on FR4 material. For verification of the proposed frontends, an frequency-modulated continuous wave (FMCW) radar system was developed and set up within this paper. Theoretical considerations and simulations as well as corresponding measurements were carried out for the evaluation of the designed system. The demonstrator results of these embedded radar sensors show an excellent system performance at a high integration level.
影响因子:
4.3
作者:
I. Nasr;B. Lämmle;K. Aufinger;G. Fischer;R. Weigel;D. Kissinger
通讯作者:
D. Kissinger
影响因子:
4.3
作者:
I. Nasr;H. Knapp;K. Aufinger;R. Weigel;D. Kissinger
通讯作者:
D. Kissinger
DOI:
10.1109/tmtt.2014.2337264
发表时间:
2014-09-01
影响因子:
4.3
作者:
Nasr, Ismail;Nehring, Johannes;Kissinger, Dietmar
通讯作者:
Kissinger, Dietmar