Low-temperature sintering properties of the screen-printed silver paste for a-Si:H/c-Si heterojunction solar cells
Low-temperature sintering properties of the screen-printed silver paste for a-Si:H/c-Si heterojunction solar cells
复制标题
a-Si:H/c-Si异质结太阳能电池丝网印刷银浆的低温烧结性能
DOI：
10.1007/s10854-014-1925-z
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发表时间：
2014-04
期刊：
影响因子：
--
通讯作者：
Wang, Wenjing
中科院分区：
文献类型：
--
作者：
Diao, Hongwei;Zhang, Wenbin;Wang, Ge;Wang, Wenjing
对于a-Si：H/c-Si异质结（SHJ）太阳能电池，需要低温烧结银浆在透明导电氧化层上制备金属电极。研究了丝网印刷低温烧结银栅极的热特性、导电性、与氧化铟锡衬底的结合强度以及烧结温度和烧结时间对银栅极微观结构的影响。结果表明，板栅的性能与其微观结构密切相关。较高的烧结温度和较长的烧结时间有利于银浆中的有机物燃尽，相邻的银颗粒聚结成较大的颗粒。结果，银网格可以获得致密的微观结构，并紧密地粘附在衬底表面上。因此，实现了低线路和接触电阻。此外，银颗粒的择优取向的演变对提高栅极导电性也有一定的贡献。具体地，对于SHJ太阳能电池制造，为了与a-Si：H的低温沉积兼容，优选在200-230 °C范围内的烧结温度下大于60分钟的长烧结时间以实现高性能Ag电接触。
For a-Si:H/c-Si heterojunction (SHJ) solar cells, low-temperature sintered silver paste is necessary to fabricate the metal electrodes on transparent conductive oxide layer. Here, the thermal characteristic, the conductivity, the adhesion strength on indium tin oxide substrate and the microstructure evolution of the screen-printed low-temperature sintered silver grid were investigated by varying the sintering temperature and the sintering time. The results show that the grid performance is closely related to its microstructure. A relatively high sintering temperature and a long sintering time are beneficial to make the organics in the Ag paste burn out and the adjacent Ag particles coalesce together to be larger ones. As a result, the Ag grid can get a dense microstructure and tightly adhere onto the substrate surface. Thus, low line and contact resistance is achieved. What is more, the evolution of the preferential orientation of Ag particles has some contributions to the improved grid conductivity. Specifically, for the SHJ solar cell fabrication, in order to be compatible with the low-temperature deposition of a-Si:H, a long sintering time larger than 60 min with the sintering temperature in the range of 200–230 °C is preferred to realize high performance Ag electrical contacts.
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影响因子：
1.5
作者：
Chun-An Lu;P. Lin;Hong-ching Lin;Sea-Fue Wang
通讯作者：
Chun-An Lu;P. Lin;Hong-ching Lin;Sea-Fue Wang
影响因子：
3.9
作者：
Chia-Ruey Chang;J. Jean
通讯作者：
Chia-Ruey Chang;J. Jean
影响因子：
3
作者：
M. Taguchi;Ayumu Yano;S. Tohoda;Kenta Matsuyama;Yuya Nakamura;Takeshi Nishiwaki;K. Fujita;E. Mar
通讯作者：
M. Taguchi;Ayumu Yano;S. Tohoda;Kenta Matsuyama;Yuya Nakamura;Takeshi Nishiwaki;K. Fujita;E. Mar
DOI：
10.1143/jjap.46.4179
发表时间：
2007-07-01
期刊：
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS
影响因子：
--
作者：
Lu, Chun-An;Lin, Pan;Wang, Sea-Fue
通讯作者：
Wang, Sea-Fue
影响因子：
6.7
作者：
Guo, Guiquan;Gan, Weiping;Liu, Huan
通讯作者：
Liu, Huan