Effect of the Angle Between Sn Grain c-Axis and Electron Flow Direction on Cu-Reinforced Composite Solder Joints Under Current Stressing
Effect of the Angle Between Sn Grain c-Axis and Electron Flow Direction on Cu-Reinforced Composite Solder Joints Under Current Stressing
复制标题
电流应力下锡晶粒c轴与电子流方向夹角对铜增强复合焊点的影响
DOI：
10.1007/s11664-017-5774-4
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发表时间：
2017
期刊：
影响因子：
--
通讯作者：
F. Guo
中科院分区：
文献类型：
--
作者：
Y. Wang;J. Han;Y.S. Wang;L.M. Ma;F. Guo
Sn晶粒具有体心四方晶系结构，在各种性能方面具有高度的各向异性。无铅钎料的电迁移行为受晶粒取向的影响。本文证明了复合焊点中c轴与电子流动方向的夹角θ是影响电迁移的重要因素。研究了角度θ对复合焊点电迁移的影响。Cu颗粒增强Sn3.5Ag焊点在室温下在104 A/cm 2的电流密度下受到应力。电流作用336 h后，在含有两个角度θ不同的Sn晶粒的复合焊点中，晶界两侧出现了不同的电迁移现象。角度θ越大，Cu_6Sn_5的生长速率越小。此外，以单个Sn颗粒的复合焊点为对比，其角度θ小于两个Sn颗粒的复合焊点。单颗粒复合焊点中Cu 6Sn 5的生长速度快于双颗粒复合焊点。
With a body-centered tetragonal crystal structure, Sn grains were demonstrated to have highly anisotropic behaviors in various properties. The electromigration behavior of lead-free solder was impacted by the grain orientations. In this paper, the angle between the c-axis and the electron flow direction in composite solder joints (angle θ) was proven to be an important factor during electromigration. The effects of angle θ on the electromigration of composite solder joints were investigated in this paper. Cu particle-reinforced Sn3.5Ag solder joints were stressed under a current density of 104 A/cm2 at room temperature. After 336 h current stressing time, different electromigration phenomena occurred at the two sides of the grain boundary in the composite solder joint which contained two Sn grains with different angle θ. The Sn grains with the larger angle θ had a smaller growth rate of Cu6Sn5. In addition, a composite solder joint with a single Sn grain was set as the contrast and its angle θ was smaller than that of the composite solder joint with two Sn grains. The growth rate of Cu6Sn5 in the composite solder joint with a single grain was faster than that of the composite solder joint with two Sn grains.
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影响因子：
2.1
作者：
Youngseok Kim;S. Nagao;T. Sugahara;K. Suganuma;M. Ueshima;H. Albrecht;K. Wilke;J. Strogies
通讯作者：
Youngseok Kim;S. Nagao;T. Sugahara;K. Suganuma;M. Ueshima;H. Albrecht;K. Wilke;J. Strogies
影响因子：
6.2
作者：
C.E. Ho;P. T. Lee;Chih Chen;Cheng-Hsien Yang
通讯作者：
C.E. Ho;P. T. Lee;Chih Chen;Cheng-Hsien Yang
影响因子：
2.1
作者：
Ruihong Zhang;Guangchen Xu;Xitao Wang;F. Guo;Andre Lee;K. N. Subramanian
通讯作者：
Ruihong Zhang;Guangchen Xu;Xitao Wang;F. Guo;Andre Lee;K. N. Subramanian
DOI：
10.1007/s10854-006-9019-1
发表时间：
2007-03-01
影响因子：
2.8
作者：
Guo, Fu
通讯作者：
Guo, Fu
影响因子：
2.1
作者：
Kinney, Chris;Linares, Xioranny;Morris, J. W., Jr.
通讯作者：
Morris, J. W., Jr.