Study on the High Temperature Interfacial Stability of Ti/Mo/Yb0.3Co4Sb12 Thermoelectric Joints
Study on the High Temperature Interfacial Stability of Ti/Mo/Yb0.3Co4Sb12 Thermoelectric Joints
复制标题
Ti/Mo/Yb0.3Co4Sb12热电接头高温界面稳定性研究
DOI：
10.3390/app7090952
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发表时间：
2017-09
影响因子：
2.7
通讯作者：
Lidong Chen
中科院分区：
文献类型：
--
作者：
Ming Gu;Shengqiang Bai;Xugui Xia;Xiangyang Huang;Xiaoya Li;Xun Shi;Lidong Chen
为了提高界面在高温下的稳定性，设计并制备了具有Ti/Mo/Yb0.3Co4Sb12三明治结构的n型Skutterudite(SKD)热电接头。在这种结构中，引入了Mo和Ti作为阻挡层，目的是抑制界面扩散，缓冲层的目的是提高结合强度。为了评价Ti/Mo/Yb0.3Co4Sb12接头的高温界面行为，在真空中进行了0~600℃的热冲击和550~650℃的等温时效。在等温时效过程中，钛渗入Mo层，最终扩散到Yb0.3Co4Sb12基体中。随着等温时效时间的延长，Ti不断扩散并与基体中的Sb、Co元素反应，形成多层结构的Ti3Sb/Ti2Sb/TiCoSb金属间化合物。研究了扩散动力学，发现Ti/Mo/Yb0.3Co4Sb12接头的界面演化为扩散控制过程。在扩散过程中，形成的Mo-Ti缓冲层起到了阻尼器的作用，在高温下极大地减缓了钛向Yb0.3Co4Sb12基体的扩散。同时发现，接头接触电阻率的提高主要来源于钛与Yb0.3Co4Sb12之间的互扩散。结果表明，Ti/Mo/Yb0.3Co4Sb12接头具有良好的界面接触电阻率稳定性。根据接触电阻率的稳定性对接头的使用寿命进行了预测，结果表明，在550℃下，Ti/Mo/Yb0.3Co4Sb12接头可以满足实际应用的要求。
To improve the interfacial stability at high temperatures, n-type skutterudite (SKD) thermoelectric joints with sandwich structures of Ti/Mo/Yb0.3Co4Sb12 were successfully designed and fabricated. In this structure, Mo and Ti were introduced as the barrier layer with the goal of suppressing the interfacial diffusion and the buffer layer with the goal of enhancing the bonding strength, respectively. To evaluate the high temperature interfacial behavior of the Ti/Mo/Yb0.3Co4Sb12 joints, thermal shocking between 0 °C and 600 °C and isothermal aging at a temperature range of 550 °C to 650 °C were carried out in vacuum. During the isothermal aging process, Ti penetrates across the Mo layer, and finally diffuses into the Yb0.3Co4Sb12 matrix. By increasing the isothermal aging time, Ti continuously diffuses and reacts with the elements of Sb and Co in the matrix, consequently forming the multilayer-structured intermetallic compounds of Ti3Sb/Ti2Sb/TiCoSb. Diffusion kinetics was investigated and it was found that the interfacial evolution of the Ti/Mo/Yb0.3Co4Sb12 joints was a diffusion-controlling process. During the diffusion process, the formed Mo-Ti buffer layer acts as a damper, which greatly decelerates the diffusion of Ti towards the Yb0.3Co4Sb12 matrix at high temperatures. Meanwhile, it was found that the increase in the contact resistivity of the joints mainly derives from the inter-diffusion between Ti and Yb0.3Co4Sb12. As a result, the Ti/Mo/Yb0.3Co4Sb12 joint demonstrates the excellent stability of the interfacial contact resistivity. Service life prediction was made based on the stability of the contact resistivity, and it was found that the Ti/Mo/Yb0.3Co4Sb12 joint is qualified for practical applications at 550 °C.
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影响因子：
3.2
作者：
HAHN, TA
通讯作者：
HAHN, TA
影响因子：
27.8
作者：
Hazan, Eden;Ben-Yehuda, Ohad;Gelbstein, Yaniv
通讯作者：
Gelbstein, Yaniv
DOI：
10.15541/jim20140378
发表时间：
2015-02
期刊：
--
影响因子：
--
作者：
唐云山;柏胜强;任都迪;廖锦城;张澜庭;陈立东
通讯作者：
唐云山;柏胜强;任都迪;廖锦城;张澜庭;陈立东
影响因子：
1.7
作者：
Xiaoyan Yang;Jiehua Wu;Ren Dudi;Tiansong Zhang;Lidong Chen
通讯作者：
Xiaoyan Yang;Jiehua Wu;Ren Dudi;Tiansong Zhang;Lidong Chen
影响因子：
2.1
作者：
Roi Vizel;Tal Bargig;O. Beeri;Y. Gelbstein
通讯作者：
Roi Vizel;Tal Bargig;O. Beeri;Y. Gelbstein