A Method of Gate-level Circuit Yield Calculation Based on PTM

A Method of Gate-level Circuit Yield Calculation Based on PTM
复制标题

一种基于PTM的门级电路良率计算方法

DOI:
10.1016/j.procs.2017.03.147
复制
发表时间:
2017-04
期刊:
Procedia Computer Science
影响因子:
--
通讯作者:
Yujiao Huang
Yujiao Huang
中科院分区:
其他
文献类型:
--
作者:
Jie Xiao;William Lee;Xuhua Yang;Haigen Hu;Yujiao Huang

文献摘要

参考文献

相似文献

目前已有的成品率模型主要针对系统级电路,忽略了电路结构对成品率的影响。结合门级电路的版图结构信息,分析了缺陷随老化时间的生长特性、广义门的拓扑结构、缺陷密度和成品率损失机制。其次,给出了时效过程中缺陷去除率的计算方法,并在此基础上建立了广义门的成品率损失概率模型。在考虑电路拓扑结构信息的基础上,结合上述模型,采用迭代PTM方法计算了部分基准电路的成品率。最后,通过与泊松分布、负二项分布和指数分布模型的预测结果进行比较,验证了该模型的有效性。此外,还分析了工艺参数、老化时间和容错技术对电路成品率的影响,得出了一些有意义的结论。
Many yield models have mainly focused on the system-level circuit, which ignores the effect of circuit structure on yield. Combining the layout structure information of the gate-level circuit, this paper firstly analyzed the growth characteristics of defects over aging time, topological structure, defect density of generalized gates and yield loss mechanisms. Second, the calculation method of the defect removal rate in aging was given, and then probability models of the yield loss of generalized gates were proposed. With consideration of the topological structure information of circuits, combining the above-mentioned models, the yields of some benchmark circuits were calculated by the iterative PTM method. Finally, the proposed model is validated by comparing its predictions with the results obtained by Poisson distribution, negative binomial distribution, and exponential distribution models. In addition, the effects of process parameters, aging time, and fault-tolerance techniques on circuit yield are analyzed, and some significant conclusions are made.
DOI: --
发表时间: 2009
期刊: --
影响因子: --
作者:
Jiang Jian-hui
通讯作者: Jiang Jian-hui
DOI: 10.1360/n112014-00107
发表时间: 2014-10
影响因子: 4.9
作者:
Jie Xiao;Jianhui Jiang;Jiarong Liang
通讯作者: Jie Xiao;Jianhui Jiang;Jiarong Liang
DOI: 10.1109/12.277291
发表时间: 1993-06
期刊: IEEE Trans. Computers
影响因子: --
作者:
I. Koren;Z. Koren;C. Stapper
通讯作者: I. Koren;Z. Koren;C. Stapper
DOI: 10.1016/s0026-2714(99)00094-3
发表时间: 1999-06
影响因子: 1.6
作者:
C. McDonald
通讯作者: C. McDonald
DOI: 10.1016/j.microrel.2010.07.154
发表时间: 2011-02
期刊: Microelectron. Reliab.
影响因子: --
作者:
Jie Han;Hao Chen;E. Boykin;J. Fortes
通讯作者: Jie Han;Hao Chen;E. Boykin;J. Fortes