Testing of surface properties pre-rad and post-rad of n-in-p silicon sensors for very high radiation environment

Testing of surface properties pre-rad and post-rad of n-in-p silicon sensors for very high radiation environment
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在极高辐射环境下测试 n-in-p 硅传感器的辐射前和辐射后表面特性

DOI:
10.1016/j.nima.2010.04.094
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发表时间:
2011
期刊:
Accelerators, Spectrometers, Detectors and Associated Equipment
影响因子:
--
通讯作者:
Lindgren S
Lindgren S
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--
文献类型:
--
作者:
Lindgren S

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我们正在开发n+ in-p, p-bulk和n-读出微带传感器,作为超级大型强子对撞机实验ATLAS跟踪器升级的非逆变辐射硬硅探测器。滨松光电制造的传感器表面辐射损伤主要表现在带间电容、带间电阻和穿孔保护演变上。检测器应提供可接受的条带隔离,超过信号读出芯片的输入阻抗~ 1 kΩ,在集成亮度为6 ab-1之后,这是亮度目标的两倍。
We are developing n+-in-p, p-bulk and n-readout, microstrip sensors as a non-inverting radiation hard silicon detector for the ATLAS Tracker Upgrade at the super LHC experiment. The surface radiation damages of the sensors fabricated by Hamamatsu Photonics are characterized on the interstrip capacitance, interstrip resistance and punch-through protection evolution. The detector should provide acceptable strip isolation, exceeding the input impedance of the signal readout chip~ 1 kΩ, after the integrated luminosity of 6 ab-1, which is twice the luminosity goal.
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发表时间: 1999
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