Silicon based in-situ measurement system for flex loads on MLCCs in PCB manufacturing chain
Silicon based in-situ measurement system for flex loads on MLCCs in PCB manufacturing chain
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PCB 制造链中 MLCC 柔性负载的硅基原位测量系统
DOI：
10.1016/j.sna.2015.06.005
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发表时间：
2015
影响因子：
4.6
通讯作者：
Schmidt
中科院分区：
文献类型：
--
作者：
Majcherek;Hirsch;Schmidt
提出了一种在线监测印制电路板制造链中多层陶瓷电容器(MLCC)器件机械载荷的新方法。S3MD(应力敏感表面贴装器件)是为0805 SMD芯片器件设计的具有应变敏感图案的硅基封装。采用Cu55Ni45和Ni65Cr35金属薄膜电阻作为电阻应变敏感元件。创建可焊接端子以获得焊料安装选项。弯曲试验如AEC Q200“Board Flex”中所述，用于获得不同MLCC端子类型的载荷极限。因此，设计了一种适合四端传感的印刷电路板。采用不同的弯曲速度来表征分析S3MD传感器元件的焊料或粘接接头的蠕变行为的可能性。最后，用旋转式刀片进行了脱脂过程，并根据切割刃距离现场测量了作用在设备上的载荷强度。
A new in-situ monitoring method of mechanical loads acting on MLCC (multi layer ceramic capacitors) devices during the PCB manufacturing chain is presented in this paper. A S3MD (stresssensitivesurface mounted device) is designed as a silicon based package equivalent with strain sensitive pattern for an 0805 SMD chip device. Metal thin film resistors of Cu55Ni45 and Ni65Cr35 are used as resistive strain sensitive elements. A solderable termination is created to get the solder mounting option. Bending tests like descripted in AEC Q200 “Board Flex” were done to obtain the load limits for different MLCC termination types. Therefore a suitable PCB is designed with 4-terminal-sensing. Different bending speeds are performed to characterize the possibility to analyze creeping behavior of the solder or adhesive joint with the S3MD sensor elements. Finally a depaneling process with rotary blade is performed with an in-situ measurement of the load intensity acting on the devices during the process depending on the cutting edge distance.
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