Filamentous Virus-based Assembly: Their Oriented Structures and Thermal Diffusivity.
Filamentous Virus-based Assembly: Their Oriented Structures and Thermal Diffusivity.
复制标题
DOI:
10.1038/s41598-018-23102-1
复制
发表时间:
2018-04-03
影响因子:
4.6
通讯作者:
Serizawa T
中科院分区:
文献类型:
--
作者:
Sawada T;Murata Y;Marubayashi H;Nojima S;Morikawa J;Serizawa T
Organic polymers are generally regarded as thermal insulators because amorphous arrangement of molecular chains reduces the mean free path of heat-conducting phonons. However, recent studies indicated that single chains of polymers with highly oriented structures could have high thermal conductivity than bulk polymers because stretched polymer chains effectively conduct phonons through polymeric covalent bonds. Here, we demonstrated the possibility of non-covalent virus assembly prepared by simple flow-induced methods toward high thermal conductive polymeric materials. Films with high thermal diffusivity composed of non-covalent bond-based assemblies of liquid crystalline filamentous viruses were prepared using a simple flow-induced orientation method. Structural and thermal characterization demonstrated that highly oriented structures of the viruses in the film were attributed to the high thermal diffusivity. Our results will open attractive opportunities for biomolecular-based thermally conductive soft materials even though the assemblies are based on non-covalent bonds.
登录
查看更多内容
影响因子:
3.9
作者:
Chung, Woo-Jae;Merzlyak, Anna;Lee, Seung-Wuk
通讯作者:
Lee, Seung-Wuk
影响因子:
2.1
作者:
Sawada, Toshiki;Asada, Masaya;Serizawa, Takeshi
通讯作者:
Serizawa, Takeshi
影响因子:
64.8
作者:
Deegan, RD;Bakajin, O;Witten, TA
通讯作者:
Witten, TA
影响因子:
29.4
作者:
Courchesne, Noemie-Manuelle Dorval;Klug, Matthew T.;Chen, Po-Yen;Kooi, Steven E.;Yun, Dong Soo;Hong, Nina;Fang, Nicholas X.;Belcher, Angela M.;Hammond, Paula T.
通讯作者:
Hammond, Paula T.
影响因子:
16.6
作者:
Oh, Jin-Woo;Chung, Woo-Jae;Lee, Seung-Wuk
通讯作者:
Lee, Seung-Wuk