Preparation of three-dimensional ceramic substrate by multiple electroforming for UV-LED hermetic packaging
Preparation of three-dimensional ceramic substrate by multiple electroforming for UV-LED hermetic packaging
复制标题
多次电铸制备UV-LED气密封装三维陶瓷基板
DOI：
10.1016/j.ceramint.2019.07.218
复制
发表时间：
2019-07
影响因子：
5.2
通讯作者：
Chen Mingxiang
中科院分区：
文献类型：
--
作者：
Yang Zizhou;Sun Qinglei;Cheng Hao;Liu Xingxing;Peng Yang;Chen Mingxiang
本文提出了基于多重光刻和电铸的三维直接镀铜（3DPC）陶瓷基板的制备方法。首先，研究了电流密度、搅拌速度和镀液温度对电沉积速率和残余应力的影响。高电沉积速率和低残余应力的最佳组合参数为电流密度4 A/dm2，搅拌速度1000 rpm，浴液温度50 ℃。其次，通过4次光刻和电铸制备了0.5 mm镍坝的3DPC陶瓷基板。最后，通过热循环试验中氦泄漏率和电铸坝与平面DPC基板的结合强度来评价3DPC基板的可靠性。经过30次热循环后，3DPC基板仍表现出良好的密封性和较高的结合强度。采用3DPC基板和石英玻璃封装的UV-LED模组具有良好的密封性和高光功率。以上结果表明，通过多次光刻和电铸制备的3DPC衬底是UV-LED密封封装的理想选择。
In this work, preparation of three-dimensional direct plated copper (3DPC) ceramic substrate was proposed based on multiple lithography and electroforming. Firstly, the effects of current density, stirring speed and bath temperature on electrodeposition rate and residual stress were investigated. An optimal combination of parameters for high electrodeposition rate and low residual stress was the current density of 4 A/dm2, the stirring speed of 1000 rpm, and the bath temperature of 50 °C. Secondly, 3DPC ceramic substrate with 0.5 mm nickel dam was prepared through 4 times lithography and electroforming. Finally, the reliability of 3DPC substrate was evaluated by helium leak rate and bonding strength between the electroforming dam and planar DPC substrate during thermal cycle test. The 3DPC substrate exhibited excellent hermeticity and high bonding strength even after 30 thermal cycles. The UV-LED module packaged using 3DPC substrate and quartz glass exhibited excellent hermeticity and high light power. The above results suggested that 3DPC substrate prepared through multiple lithography and electroforming could be a promising candidate for UV-LED hermetic packaging.
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DOI：
10.1109/commad.1998.791668
发表时间：
1998-12
期刊：
1998 Conference on Optoelectronic and Microelectronic Materials and Devices. Proceedings (Cat. No.98EX140)
影响因子：
--
作者：
W. Qu;C. Wenzel;A. Jahn;D. Zeidler
通讯作者：
W. Qu;C. Wenzel;A. Jahn;D. Zeidler
影响因子：
2.1
作者：
Moonsu Seo;Dong-Jin Kim;Joung-Soo Kim
通讯作者：
Moonsu Seo;Dong-Jin Kim;Joung-Soo Kim
DOI：
10.1109/ipfa.2007.4378075
发表时间：
2007-07
期刊：
2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits
影响因子：
--
作者：
D. Wolf;A. Jourdain;P. de Moor;H. Tilmans;L. Marchand
通讯作者：
D. Wolf;A. Jourdain;P. de Moor;H. Tilmans;L. Marchand
影响因子：
3.2
作者：
B. Sheldon;A. Ditkowski;R. Beresford;E. Chason;J. Rankin
通讯作者：
B. Sheldon;A. Ditkowski;R. Beresford;E. Chason;J. Rankin
影响因子：
5.4
作者：
Pathak, Siddhartha;Guinard, Marion;Philippe, Laetitia
通讯作者：
Philippe, Laetitia