Ball Formation Processes in Wire Bonding Apparatus

全球制造的集成电路超过一半 具有通过球焊工艺连接的引线。 几乎所有 关于这个过程的信息是经验性的--一个分析模型 不存在. 在连接过程中，焊线被加热 通过放电;然后它熔化并在下面形成一个球， 表面张力的影响。 将球压到触点上， 硅芯片来形成键合。 研究人员将研究球 通过放大实验，使用高速电影形成。 金线在空气中，铝合金线在空气中和在氩气中， 采用 该合金将含有镁作为强化剂，但 还将评估其它合金。

More than half of the integrated circuits manufactured in the world have wire leads attached by the ball-bonding process. Almost all of the information about this process is empirical--an analytical model does not exist. In the attachment process the bonding wire is heated by an electric discharge; it then melts and forms a ball under the influence of surface tension. The ball is pressed onto the contacts on the silicon chip to form a bond. The researcher will study ball formation by scaled-up experiments, using high-speed motion pictures. Gold wire in air, and aluminum alloy wire in air and in argon will be used. The alloy will contain magnesium as the strengthening agent, but other alloys will also be evaluated.