Ball Formation Processes in Wire Bonding Apparatus

这个项目涉及集成电路的制造。 具体来说，它涉及适当的金属丝之间的键合 芯片上的结和支撑引线框架上的端子。 键合线通过放电加热，熔化，形成键合线。 球并被压到触点以形成键合。 不安全债券 可能是由于球成形不当造成的。 尽管无处不在， 半导体芯片制造过程中，没有基础研究 提供了对放电和热传递的理解 涉及的现象。 这项研究的目的是提供一个明确的 了解所涉机制并建立 出球参数与球质量参数之间的关系。 两名本科生将参与这项研究。

This project deals with the manufacture of integrated circuits. Specifically, it deals with the bonding of wire between proper junctions on the chip and terminals on the supporting lead frame. The bonding wire is heated by an electric discharge, melts, forms a ball and is pressed to the contacts to form a bond. Insecure bonds can result from improperly formed balls. Despite the ubiquity of the process in semiconductor chip fabrication, no fundamental study has yet provided understanding of the discharge and heat transfer phenomena involved. The object of this study is to provide a clear picture of the mechanisms involved and to establish the relationship between discharge parameters and ball quality parameters. Two undergraduate students will participate in this research.