Advances in Design of Automated Wire and Die Bonding Machinery in Microelectronic Manufacturing

这项研究解决了两个离散的问题， 出现在自动化机械，执行模具和线 微电子制造中的键合操作， 高吞吐量。 机器设计中的问题是由于 对传热问题的基本认识不足 以及金属与金属和金属与半导体的键合， 在材料界面扩散。 研究认为， 这些问题中的每一个，并通过一个 结合实验程序和物理/数值模拟。 实验室设施可用于实验研究 和访问大型计算机是可用的， 数值模拟

This research addresses two discrete problems that have arisen in the automated machinery that performs the die and wire bonding operations in microelectronic manufacturing with very high throughput. The problems in machine design are a result of inadequate fundamental understanding of problems in heat transfer and metal to metal and metal to semiconductor bonding partly due to diffusion at the material interface. The research considers each of these problems and addresses the solution through a combined experimental program with physical/numerical modeling. Laboratory facilities are available for the experimental research and access to large scale computers is available for the numerical modeling.