Low Energy Arc Heat Transfer with Applications in Microelectronic Packaging Technology

摘要本文对不同电极之间的低能电弧传热进行了数值分析和实验验证。应用是提供理解和可能的改进在微电子的线键合芯片到帧互连过程。该实验是实际低能量电弧焊线过程的60倍放大模型，将密切模拟实际工业过程。数值模型的预测将与实验结果进行核对，并对模型进行改进，直到达到良好的预测精度。

CTS-9421598 Ira M. Cohen ABSTRACT This work is a numerical analysis with experimental validation of low energy arc heat transfer between dissimilar electrodes. Application is to provide understanding and possible improvement in the wire-bonding chip-to-frame interconnection process in microelectronics. The experiment is a 60-times scaled-up model of the actual low-energy-arc wire-bonding process which will closely simulate the actual industrial process. Predictions from the numerical model will be checked against experimental results, and the model will be refined until it achieves good prediction accuracy.