U.S.-Japan Joint Seminar: Alloy Semiconductor Physics and Electronics / Honolulu, Hawaii / May 1988

该奖项将支持美国科学家参加由犹他大学的Gerald Stringfellow教授和日本京都大学的佐佐木昭夫教授共同组织的“合金半导体物理与电子学”研讨会。美国和日本的参加者将于1988年5月在夏威夷的檀香山会晤。研讨会将重点讨论合金半导体的材料方面，包括：合金半导体的生长过程、晶体微观结构、性能和器件潜力。半导体合金是当前和未来电子器件中最重要的材料之一，因为它们为器件应用提供了高度的灵活性。然而，我们对这些材料的化学和物理方面的理解是原始的。本次研讨会将为交流最新的研究成果和想法提供一个论坛，从而促进美国和日本研究人员在这一快速发展的半导体合金领域的合作研究。

This award will support the participation of U.S. scientists in a seminar on "Alloy Semiconductor Physics and Electronics," organized jointly by Professor Gerald Stringfellow of the University of Utah and Professor Akio Sasaki of Kyoto University, Japan. United States and Japanese participants will meet in Honolulu, Hawaii during May 1988. The seminar will focus on materials aspects of alloy semiconductors, including the following: the growth process, crystalline microstructure, and the properties and device potential of alloy semiconductors. Semiconductor alloys are among the most important materials for current and future electron devices because they offer a high degree of flexibility for device applications. However, our understanding of the chemical and physical aspects of these materials is primitive. This seminar will provide a forum for the exchange of recent research results and ideas, and thus foster collaborative studies between U.S. and Japanese researchers in this rapidly advancing field of semiconductor alloys.