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Interface Velocity and Pattern Formation in Electrochemical Deposition Far from Equilibrium

Interface Velocity and Pattern Formation in Electrochemical Deposition Far from Equilibrium
远离平衡的电化学沉积中的界面速度和图案形成
批准号:
8915745
负责人:
Dale Barkey
金额:
$12.18万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
1990
资助国家:
美国
项目状态:
已结题
起止时间:
1990-07-01 至 1993-12-31

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中文摘要
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英文摘要
Theoretically based engineering correlations are developed for prediction of structure, scaling properties, and growth velocities far from equilibrium in electrochemical deposition. Structures and structural transitions are correlated with control parameters and are recorded with high-resolution photomacroscopy. The principles governing destabilization of an initially smooth growth front and its dynamic restabilization into a structured aggregate are formulated by analysis of the diffusion and electric fields with consideration of concentration, kinetic overpotential, and double-layer charging. Schlieren photography is used to image the diffusion field around growing aggregates. The role of the surface overpotential is probed using AC impedance measurements. The theory developed in this project and the control strategies derivative from it will have broad applicability whenever electrically induced aggregation is either necessary or detrimental. Test metals for the experimental verification are selected to be technologically relevant, so that the results should be immediately applicable in battery and microelectronic circuit production.
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GOALI: Synthesis, Composition and Thermal Properties of Metal Nano-Particles for Printable Conductive Media
  • 批准号:
    1200544
  • 项目类别:
    Standard Grant
  • 资助金额:
    $45.0万
  • 财政年份:
    2012
  • 负责人:
    Dale Barkey
  • 依托单位:
GOALI: Chemical Design and Electrochemical Process Engineering for Micro-Fabrication
  • 批准号:
    0930107
  • 项目类别:
    Standard Grant
  • 资助金额:
    $34.5万
  • 财政年份:
    2009
  • 负责人:
    Dale Barkey
  • 依托单位:
Microscopic Dynamics of Roughening in Copper Electroplating
  • 批准号:
    9815067
  • 项目类别:
    Standard Grant
  • 资助金额:
    $18.33万
  • 财政年份:
    1999
  • 负责人:
    Dale Barkey
  • 依托单位:
Atomic Force Microscopic and Ring Disk Voltammetric Studies on the Role of Chloride and Oxygen in Copper Electroplating
  • 批准号:
    9622634
  • 项目类别:
    Standard Grant
  • 资助金额:
    $3.13万
  • 财政年份:
    1996
  • 负责人:
    Dale Barkey
  • 依托单位:
海外基金