GOALI: Chemical Design and Electrochemical Process Engineering for Micro-Fabrication
目标:微制造的化学设计和电化学工艺工程
基本信息
- 批准号:0930107
- 负责人:
- 金额:$ 34.5万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Standard Grant
- 财政年份:2009
- 资助国家:美国
- 起止时间:2009-08-01 至 2012-07-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
0930107BarkeyThis GOALI proposal, to be carried out in partnership with Rohm and Haas Electronic Materials LLC, will advance the science and engineering of electrodeposition for fabrication of micro-devices and components including micro machines, passive electronic devices and electronic interconnects. The versatile chemistry of the acid-sulfate copper plating bath with additives makes it ideal for a broad class of micro-fabrication and electronics packaging applications. The work is based on the central role of interactions among additives, Cu(I) and dissolved oxygen. The local concentration of the latter two species can be controlled dynamically through such steps as pulse-reverse current to generate Cu(I) and gas diffusers to introduce oxygen. These ideas have been successfully implemented by the PI in filling of through-silicon vias. This work is intended to expand through-chip filling capabilities and to extend the process to encompass additional fabrication tasks, including the coating of interior recesses through restricted openings, and the filling of cavities in through-mask systems where the electrolyte is confined to a microscopic volume bounded by anode, substrate and mask. The work will encompass real fabrication processes on both bench and pilot scales as well as synthetic chemistry, electroanalytical studies and process modeling. This work will bring a comprehensive reaction-engineering perspective to the problem and advance beyond the conventional current-distribution understanding of simpler electroplating processes. Broader Impacts: This GOALI project will be carried out in partnership with Rohm and Haas Electronic Materials LLC through its facility in Freeport, NY. The research will enable advances in micro-fabrication and semi-conductor device manufacture with potential economic and societal benefits that include growth in the US high-tech manufacturing economy, new consumer products based on dense vertical semi-conductor packaging and advances in biomedical engineering based on micro-devices. In addition, the award will support the efforts of the UNH PI and Co-PI to engage undergraduate students in meaningful research projects. Continuing recruitment efforts by the PI include visits to area high schools and participation in the freshman environmental engineering lectures. The Chemical Engineering Department at UNH has been successful in recruiting and retaining women and underrepresented minorities in its program. In the past three years, the PI has supported four undergraduate researchers, including African-American and Vietnamese-American NH residents. The budget for the current project will include support for four undergraduate students per year, and the PI will make every effort to recruit students from under-represented groups into the project. The PI has served as a Mentor in the Ronald E. McNair Post-Baccalaureate Achievement Program, one of the TRIO Programs funded by Title IV of the Higher Education Act of 1965. The program is designed to encourage students from economically challenged and racially diverse backgrounds to consider and prepare for post graduate study and research. The PI intends to continue to serve in this program and to make his lab available for research projects by McNair Fellows.
[09:30107 . barkeygoali的这项提案将与Rohm and Haas电子材料有限责任公司合作进行,将推进电沉积的科学和工程,用于制造微型设备和组件,包括微型机器、无源电子设备和电子互连。具有添加剂的酸硫酸盐镀铜浴的多功能化学使其成为广泛的微制造和电子封装应用的理想选择。这项工作是基于添加剂之间的相互作用,Cu(I)和溶解氧的中心作用。后两种物质的局部浓度可以通过脉冲反向电流产生Cu(I)和气体扩散器引入氧气等步骤进行动态控制。这些思想已被PI成功地应用于硅通孔的填充。这项工作旨在扩展通片填充能力,并扩展该工艺以涵盖额外的制造任务,包括通过受限开口涂覆内部凹槽,以及在通膜系统中填充腔体,其中电解质被限制在由阳极,衬底和掩膜包围的微观体积内。这项工作将包括在实验台上和中试规模上的实际制造过程,以及合成化学、电分析研究和过程建模。这项工作将带来一个全面的反应工程的角度来解决这个问题,并超越传统的电流分布的理解更简单的电镀工艺。更广泛的影响:该GOALI项目将与罗门哈斯电子材料有限责任公司合作,通过其在纽约州自由港的工厂进行。该研究将推动微制造和半导体设备制造的进步,具有潜在的经济和社会效益,包括美国高科技制造业经济的增长,基于密集垂直半导体封装的新消费产品以及基于微设备的生物医学工程的进步。此外,该奖项将支持UNH PI和Co-PI的努力,使本科生参与有意义的研究项目。PI继续进行的招聘工作包括访问地区高中和参加新生环境工程讲座。UNH的化学工程系在招募和留住女性和代表性不足的少数族裔方面取得了成功。在过去的三年里,PI资助了四名本科生研究人员,其中包括非裔美国人和越南裔美国人。目前项目的预算将包括每年4名本科生的资助,PI将尽一切努力从代表性不足的群体中招募学生加入该项目。PI曾担任Ronald E. McNair后学士学位成就项目的导师,该项目是1965年高等教育法第四章资助的三个项目之一。该计划旨在鼓励来自经济困难和种族不同背景的学生考虑和准备研究生学习和研究。PI打算继续在这个项目中服务,并使他的实验室可用于麦克奈尔研究员的研究项目。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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Dale Barkey其他文献
Dale Barkey的其他文献
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{{ truncateString('Dale Barkey', 18)}}的其他基金
GOALI: Synthesis, Composition and Thermal Properties of Metal Nano-Particles for Printable Conductive Media
GOALI:可印刷导电介质用金属纳米粒子的合成、组成和热性能
- 批准号:
1200544 - 财政年份:2012
- 资助金额:
$ 34.5万 - 项目类别:
Standard Grant
Microscopic Dynamics of Roughening in Copper Electroplating
铜电镀粗化的微观动力学
- 批准号:
9815067 - 财政年份:1999
- 资助金额:
$ 34.5万 - 项目类别:
Standard Grant
Atomic Force Microscopic and Ring Disk Voltammetric Studies on the Role of Chloride and Oxygen in Copper Electroplating
原子力显微镜和环盘伏安法研究氯和氧在铜电镀中的作用
- 批准号:
9622634 - 财政年份:1996
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Conductive-Polymer Filaments for Sensors
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9520168 - 财政年份:1995
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Interfacial Dynamics of Dendrite Electrodeposition
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- 批准号:
9306837 - 财政年份:1993
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Interface Velocity and Pattern Formation in Electrochemical Deposition Far from Equilibrium
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8915745 - 财政年份:1990
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Standard Grant
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