Microscopic Dynamics of Roughening in Copper Electroplating

铜电镀粗化的微观动力学

• 批准号: 9815067
• 负责人: Dale Barkey
• 金额: $ 18.33万
• 依托单位: University of New Hampshire
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1999
• 资助国家: 美国
• 起止时间: 1999-01-15 至 2002-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9815067&HistoricalAwards=false
• 关键词: Microscopic; Dynamics; Roughening; Copper; Electroplating

Electroplated copper is used in the fabrication of microelectronic devices. Because of its superior conductivity and scalability, it is likely to replace aluminum alloys for on-chip interconnects. The engineering design and control of plating processes rely on surface-active additives. This project is an experimental study of chemical and molecular surface processes, which determine the microscopic properties of the plated surface. Chloride ion and dissolved oxygen will be used as model additives in a first step toward generalizing the impact of surface processes on the organization of material on the sub-micron level during crystal growth. The central work of the project will be the quantitative measurement and analysis, by in-situ atomic-force microscopy, of the dynamic surface properties of homoepitaxial deposits on copper single crystals and on vapor-deposited seed layers during plating and at open circuit. The rates of change of key features will be used to evaluate surface processes, particularly nucleation, point of discharge, and surface diffusion, as they depend on deposition parameters and the presence of additive films. A rotating ring-disk electrode will be used to study the surface chemical regime and its relationship to the growth mechanisms. Exploratory work to determine the interactions of inorganic components with organic additives will be initiated.

电镀铜用于制造微电子器件。 由于其上级导电性和可扩展性，很可能取代铝合金用于片上互连。 电镀工艺的工程设计和控制依赖于表面活性添加剂。 该项目是化学和分子表面过程的实验研究，这些过程决定了电镀表面的微观特性。 氯离子和溶解氧将用作模型添加剂，这是概括晶体生长期间表面过程对亚微米级材料组织影响的第一步。 该项目的中心工作将是通过原位原子力显微镜定量测量和分析铜单晶和气相沉积籽晶层上同质外延沉积物在电镀期间和开路时的动态表面特性。 关键特征的变化率将用于评估表面过程，特别是成核、放电点和表面扩散，因为它们取决于沉积参数和添加剂膜的存在。 一个旋转的环盘电极将被用来研究的表面化学制度和它的关系的增长机制。 将开始探索性工作，以确定无机成分与有机添加剂的相互作用。