RIA: Novel Millimeter-Wave Power Combining Structures

该研究启动奖将研究毫米波功率组合结构的新方法。提出了几种新的基于网络和空间的功率组合结构。这些电路可以将大量三个终端设备在毫米波区域产生的功率组合在一起。所提出的功率组合结构具有平面性和周期性。这些组合结构适合于晶圆级集成。提出了一种采用Rucker多器件对称振荡器作为二级功率组合电路的二维功率合成器。在这种情况下，可以组合更多的设备，并且可以更有效地利用芯片的真实状态。本文将使用黑川的方法研究所提出的组合器的多器件-电路相互作用，并确定稳定运行的标准。这些合成器将设计和制造用于35 GHz的工作。将确定所提出的组合结构的噪声性能、频率稳定性、可靠性因素、高次谐波的影响和功率组合效率。

This Research Initiation Award will investigate novel approaches in millimeter wave power combining structures. Several new network-based and spatial power combining structures are proposed. These circuits can combine the power generated by large number of three terminal devices in the millimeter- wave region. The proposed power combining structures are planar and periodic. These combining structures are suitable for wafer scale integration. Also a two dimensional power combiner is proposed which uses Rucker's multi-device symmetrical oscillator as a second level power combining circuit. In this case, more devices can be combined and the chip's real state can be used more efficiently. The multiple device-circuit interaction for the proposed combiners will be investigated using Kurokawa's method and the criteria for stable operation will be determined. These combiners will be designed and fabricated for operation at 35 GHz. The noise performance, frequency stability, reliability factors, effect of higher harmonics and power combining efficiency of the proposed combining structures will be determined.