RIA: Novel Millimeter-Wave Power Combining Structures

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This Research Initiation Award will investigate novel approaches in millimeter wave power combining structures. Several new network-based and spatial power combining structures are proposed. These circuits can combine the power generated by large number of three terminal devices in the millimeter- wave region. The proposed power combining structures are planar and periodic. These combining structures are suitable for wafer scale integration. Also a two dimensional power combiner is proposed which uses Rucker's multi-device symmetrical oscillator as a second level power combining circuit. In this case, more devices can be combined and the chip's real state can be used more efficiently. The multiple device-circuit interaction for the proposed combiners will be investigated using Kurokawa's method and the criteria for stable operation will be determined. These combiners will be designed and fabricated for operation at 35 GHz. The noise performance, frequency stability, reliability factors, effect of higher harmonics and power combining efficiency of the proposed combining structures will be determined.