Analysis and Design of Electronic System Packaging and Interconnect

本研究针对从微电路和封装版图描述中提取三维电路模型的问题，利用新发展的渐近波形评估（AWE）技术，以有效的方式建立互连模型。AWE的几个特点使这种方法具有吸引力：与传统的互连提取和模拟方法相比，速度更快；能够进行有效的时域灵敏度分析；处理分布式元素而不创建集总模型的能力；一种建立线性互连宏观模型的有效策略并且易于处理三维电磁问题（涉及分布电阻、电容、电感以及延迟效应）。AWE敏感性分析有助于确定必须用详细模型提取的“关键”网；这将使剩余的蚊帐得到更简单的处理，从而提高效率。这项工作的第一项任务是通过开发一种仿真策略，将AWE对电路线性部分（互连）的好处与现有非线性电路元件（如晶体管）的一般仿真算法相结合，对包含高速互连的非线性电路进行有效仿真。第二个任务是从三维互连几何结构中有效地提取精确的电路模型。这样做的方式是，随后的电路模拟仍然有效。通过消除详细的互连模型并用宏模型代替，提高了仿真效率。

This research is directed toward the problem of extracting three- dimensional circuit models from microcircuit and packaging layout descriptions by using the newly developed Asymptotic Waveform Evaluation (AWE) technique to develop interconnect models in an efficient manner. Several features of AWE make this approach attractive: a large speed-up over traditional interconnect extraction and simulation methods; the ability to perform efficient time-domain sensitivity analysis; the capability to handle distributed elements without making a lumped model; an efficient strategy for building macromodels of linear interconnect; and the ease with which three-dimensional electromagnetic problems (involving distributed resistance, capacitance, inductance, as well as retardation effects) can be handled. AWE sensitivity analysis helps to identify "critical" nets which must be extracted with detailed models; this should improve efficiency by allowing the remaining nets to be treated more simply. The first task in this work is the efficient simulation of nonlinear circuits which contain high-speed interconnect by development of a simulation strategy which combines the benefits of AWE for the linear portion of the circuit (interconnect) with the generality of existing simulation algorithms for the nonlinear circuit elements (such as transistors). The second task is the efficient extraction of accurate circuit models from three- dimensional interconnect geometry. This is done in such a way that the subsequent circuit simulation remains efficient. Greater simulation efficiency is achieved by eliminating the detailed interconnect models and replacing them by macromodels.