Analysis and Design of Electronic System Packaging and Interconnect

电子系统封装和互连的分析与设计

• 批准号: 9216942
• 负责人: Ronald Rohrer
• 金额: $ 27万
• 依托单位: Carnegie-Mellon University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1993
• 资助国家: 美国
• 起止时间: 1993-01-01 至 1997-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9216942&HistoricalAwards=false
• 关键词: Analysis; Design; Electronic; System; Packaging

This research is directed toward the problem of extracting three- dimensional circuit models from microcircuit and packaging layout descriptions by using the newly developed Asymptotic Waveform Evaluation (AWE) technique to develop interconnect models in an efficient manner. Several features of AWE make this approach attractive: a large speed-up over traditional interconnect extraction and simulation methods; the ability to perform efficient time-domain sensitivity analysis; the capability to handle distributed elements without making a lumped model; an efficient strategy for building macromodels of linear interconnect; and the ease with which three-dimensional electromagnetic problems (involving distributed resistance, capacitance, inductance, as well as retardation effects) can be handled. AWE sensitivity analysis helps to identify "critical" nets which must be extracted with detailed models; this should improve efficiency by allowing the remaining nets to be treated more simply. The first task in this work is the efficient simulation of nonlinear circuits which contain high-speed interconnect by development of a simulation strategy which combines the benefits of AWE for the linear portion of the circuit (interconnect) with the generality of existing simulation algorithms for the nonlinear circuit elements (such as transistors). The second task is the efficient extraction of accurate circuit models from three- dimensional interconnect geometry. This is done in such a way that the subsequent circuit simulation remains efficient. Greater simulation efficiency is achieved by eliminating the detailed interconnect models and replacing them by macromodels.

本研究针对的问题是提取三个- 基于微电路和封装布局的三维电路模型 描述使用新开发的渐近波形 评估（AWE）技术来开发互连模型， 有效方式 AWE的几个特性使得这种方法 吸引人的：与传统互连相比， 提取和模拟方法;执行高效 时域灵敏度分析;处理能力 分布式元件，而不进行集总模型;高效 建立线性互连宏模型的策略;以及 三维电磁问题 （包括分布电阻、电容、电感，以及 作为延迟效应）。 AWE敏感性分析 有助于确定必须使用 详细的模型;这应该通过允许 剩下的蚊帐需要更简单的处理。 这项工作的第一个任务是有效地模拟 包含高速互连的非线性电路， 开发一种模拟策略， AWE的线性部分的电路（互连）， 现有的非线性仿真算法的通用性 电路元件（如晶体管）。 第二项责任则是 从三个电路模型中有效提取精确的电路模型， 三维互连几何形状。 这是以这样一种方式完成的， 随后的电路仿真仍然有效。 更大 仿真效率是通过消除详细的 将模型相互连接，并用宏模型替换它们。