Engineering Faculty Internship: Dynamics of Surface Mount Device Placement and Reflow During Printed Circuit Board Assembly

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The project is designed to conduct studies at a manufacturing facility dealing with surface mount technology and the development of the processes required to monitor the placement of surface mount components, before and after the reflow process. The intent of the research effort is to develop in line process monitors and to verify if such monitors are useful in controlling the placement of fine pitch surface mount components on printed circuit boards after the reflow process is complete.