Engineering Faculty Internship: Dynamics of Surface Mount Device Placement and Reflow During Printed Circuit Board Assembly

工程学院实习：印刷电路板组装过程中表面贴装器件贴装和回流的动态

• 批准号: 9311718
• 负责人: Harold Brown
• 金额: $ 2.5万
• 依托单位: Florida Institute of Technology
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1993
• 资助国家: 美国
• 起止时间: 1993-07-01 至 1995-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9311718&HistoricalAwards=false
• 关键词: Engineering; Faculty; Internship; Dynamics; Surface

The project is designed to conduct studies at a manufacturing facility dealing with surface mount technology and the development of the processes required to monitor the placement of surface mount components, before and after the reflow process. The intent of the research effort is to develop in line process monitors and to verify if such monitors are useful in controlling the placement of fine pitch surface mount components on printed circuit boards after the reflow process is complete.

该项目的目的是进行研究，在一个制造业 表面贴装技术设备及其发展 监测表面贴装的放置所需的过程 在回流焊工艺之前和之后， 研究工作的目的是开发符合 过程监视器，并验证这些监视器是否在 控制细间距表面安装元件的放置 在回流工艺完成后的印刷电路板上。