Planning Grant for a Joint Industry/University Cooperative Center Called the Optoelectrnic Circuitry and Packaging (OCP) Center

为名为光电电路和封装（OCP）中心的工业/大学联合合作中心规划拨款

• 批准号: 9312427
• 负责人: Mario Dagenais
• 金额: $ 1万
• 依托单位: University of Maryland, College Park
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1993
• 资助国家: 美国
• 起止时间: 1993-06-15 至 1994-05-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9312427&HistoricalAwards=false
• 关键词: Planning; Grant; Joint; Industry; University

This award is for a planning grant to determine the interest of industry in joining a satellite I/UCRC to the established I/UCRC for Optoelectronic Circuitry presently in operation at the University of Arizona. This satellite I/UCRC is planned for the University of Maryland and will complement the activities of the I/UCRC at the University of Arizona. The focus of the proposed I/UCRC at the University of Maryland will be Optoelectronic interconnect and packaging. The Program Director recommends an award of $10,000 for one year be awarded to the University of Maryland for the planning grant.

这个奖项是一个规划补助金，以确定利息 将卫星I/UCRC加入已建立的I/UCRC 对于目前正在运行的光电电路， 亚利桑那大学。 该卫星I/UCRC计划用于 马里兰州大学，并将补充 I/UCRC在亚利桑那大学。 建议的重点 马里兰州大学的I/UCRC将采用光电技术 互连和封装。 项目总监建议奖励一人10，000美元 一年被授予马里兰州大学的规划 格兰特.