SGER: Laser Micromachining of Submillimeter Waveguide Components

9414468步行者 在设计低噪声、高效率、外差接收机和亚毫米波本振源时遇到的障碍包括波导结构的质量和成本。 在短于400 μ m的波长处，矩形波导结构、喇叭天线和背短路变得难以使用标准加工技术来制造。 硅微加工技术将用于制造高质量的波导结构和组件，用于在亚毫米波长。 该项目的目标是开发必要的技术，以建造高效率、低成本的外差阵列接收器和信号源，这些接收器和信号源工作在太赫兹频率范围内。 硅激光蚀刻将通过构造和测试用于492和850 GHz的硅微机械波导混频器阵列来演示。 这些阵列将与马克斯·普朗克射电天文学研究所合作建造。 ***

9414468 Walker Obstacles encountered in designing low noise, high efficiency, heterodyne receivers and local oscillator (LO) sources at submillimeter wavelengths include the quality and cost of waveguide structures. At wavelengths shorter than 400 um, rectangular waveguide structures, feedhorns, and backshorts become prohibitively difficult to fabricate using standard machining techniques. Silicon micro-machining techniques will be used to fabricate high quality waveguide structures and components for use at submillimeter wavelengths. The objective of this project is to develop the technology necessary to construct high efficiency, low-cost heterodyne array receivers and signal sources which operate into the terahertz frequency range. Silicon laser etching will be demonstrated by constructing and testing silicon micromachined waveguide mixer arrays for use at 492 and 850 GHz. These arrays will be built in collaboration with the Max Planck Institute for Radio Astronomy. ***