NSF-CGP Science Fellowship Program: Effects of Cu Concentration and Line Width on Electromigration-Induced Submicron Al Interconnects

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9418769 Grosjean This proposal supports a two-year postdoctoral fellowship for Dr. David Grosjean at NEC Corporation at Tsukuba and at the Research Center for Utra-High Voltage Electron Microscopy at Osaka University. Project funding will enable Dr. Grosjean to spend two years in Japan, resident at NEC, in order to conduct research on microelectronics with Dr. Hidekazu Okabayashi and other Japanese electrical engineers. The PI has proposed to work on the very challenging and technologically important problem of the electromigration of aluminum atoms at high electric current density in submicron aluminum lines. He will also gain knowledge of metal film preparation and electrical characterization and stressing equipment. As a postdoctoral fellow, Dr. Grosjean will have the opportunity to become familiar with research techniques and equipment at NEC Corporation and Osaka University. Therefore, this proposal fulfills the objectives of the Program in its exchange and transfer of scientific knowledge through an international collaboration. ***