Optical Systems and Optoelectronic Packaging Based on Batch-Processed Microactuated Technologies

基于批处理微驱动技术的光学系统和光电封装

• 批准号: 9419112
• 负责人: Kam Yin Lau
• 金额: $ 16万
• 依托单位: University of California-Berkeley
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1995
• 资助国家: 美国
• 起止时间: 1995-02-01 至 1996-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9419112&HistoricalAwards=false
• 关键词: Optical; Systems; Optoelectronic; Packaging; Based

9419112 Lau A revolutionary, yet practical, approach to optoelectronic packaging which abandons traditional methods based upon permanent, precise placement of optical components inside the module will be investigated. In the new approach, microactuators are included inside the adaptively-packaged module to provide for continuous optimization of the alignment of optical components. The control signals fed back to the microactuators are derived from monitoring one or more key performance parameters of the system. In addition to the obvious benefit of this design, this new approach actually reduces the manufacturing cost because it replaces the active monitoring/alignment procedure now performed on each module individually on the manufacturing floor (often manually), by batch-manufacturing procedures. The precise alignment needed for high-performance modules will be accomplished automatically in the field under electronic servo control. The work represents a joint effort between the optoelectronics group and the sensors and actuators group at the University of California at Berkeley. The goals of this projects are: (1) development of silicon surface-micromachined technology for fabrication of alignment structures which possess the motion range, accuracy, and optical properties needed for adaptive optoelectronic packaging; (2) rigorous testing of these structures in regard to their optical properties, mechanical integrity, and environmental robustness; (3) demonstration of a simple optoelectronic module, specifically a pigtailed laser module, as a tool investigate issues related to adaptive packaging; (4) demonstration of high-performance, high-functionality optical subsystem, namely, a continuously-tunable narrow -linewidth external-cavity diode-laser, for investigation of the ultimate potential and limits of adaptive optoelectronic packaging. Successful development of this technology will lead to a great reduction in production costs of sophisticated and high-functionality optoelect ronic components and subsystems, presently available only as high cost, and sometimes laboratory-bound, bench-top instruments. This development is essential in order for optical and optoelectronic systems to make wide and lasting impact on the communication and computing infrastructures. ***

9419112刘将研究一种革命性而又实用的光电封装方法，该方法摒弃了基于永久、精确地将光学元件放置在模块内的传统方法。在新的方法中，微致动器被包括在自适应封装模块中，以提供对光学元件对准的持续优化。反馈到微执行器的控制信号是从监视系统的一个或多个关键性能参数得到的。除了这种设计的明显好处外，这种新方法实际上降低了制造成本，因为它取代了现在在制造车间单独对每个模块执行的主动监控/对准程序(通常是手动)，而是批量制造程序。高性能模块所需的精确对准将在电子伺服控制下在现场自动完成。这项工作代表了光电子学小组和加州大学伯克利分校传感器和致动器小组的共同努力。该项目的目标是：(1)开发硅表面微机械加工技术，用于制造具有自适应光电子封装所需的运动范围、精度和光学特性的对准结构；(2)对这些结构的光学特性、机械完整性和环境稳定性进行严格测试；(3)演示简单的光电子模块，特别是尾纤激光模块，作为研究与自适应封装相关的问题的工具；(4)展示高性能、高功能的光学子系统，即可连续调谐的窄线宽外腔半导体激光器，以研究自适应光电子封装的最终潜力和局限性。这项技术的成功开发将极大地降低复杂和高功能光电子元件和子系统的生产成本，目前只能以高成本、有时是实验室约束的台式仪器的形式提供。为了使光学和光电子系统对通信和计算基础设施产生广泛和持久的影响，这一发展至关重要。***