Optical Systems and Optoelectronic Packaging Based on Batch-Processed Microactuated Technologies

9419112 Lau将研究一种革命性的、实用的光电封装方法，该方法放弃了基于光学元件在模块内永久精确放置的传统方法。在新方法中，微致动器包含在自适应封装模块中，以提供光学元件对准的持续优化。反馈给微执行器的控制信号来源于对系统一个或多个关键性能参数的监测。除了这种设计的明显好处之外，这种新方法实际上还降低了制造成本，因为它取代了现在在制造车间（通常是手动的）每个模块上单独执行的主动监控/校准过程，通过批量制造过程。高性能模块所需的精确对准将在电子伺服控制下在现场自动完成。这项工作是加州大学伯克利分校光电小组和传感器及致动器小组共同努力的结果。本项目的目标是：(1)发展硅表面微机械加工技术，用于制造具有自适应光电封装所需的运动范围、精度和光学特性的对准结构；(2)对这些结构的光学性能、机械完整性和环境稳健性进行严格测试；(3)演示一个简单的光电模块，特别是一个尾纤激光模块，作为研究自适应封装相关问题的工具；(4)展示高性能、高功能的光学子系统，即连续可调谐窄线宽外腔二极管激光器，以研究自适应光电封装的最终潜力和局限性。该技术的成功开发将大大降低复杂和高功能光电元件和子系统的生产成本，目前只能作为高成本，有时仅限于实验室，台式仪器。为了使光学和光电子系统对通信和计算基础设施产生广泛而持久的影响，这一发展是必不可少的。＊＊＊

9419112 Lau A revolutionary, yet practical, approach to optoelectronic packaging which abandons traditional methods based upon permanent, precise placement of optical components inside the module will be investigated. In the new approach, microactuators are included inside the adaptively-packaged module to provide for continuous optimization of the alignment of optical components. The control signals fed back to the microactuators are derived from monitoring one or more key performance parameters of the system. In addition to the obvious benefit of this design, this new approach actually reduces the manufacturing cost because it replaces the active monitoring/alignment procedure now performed on each module individually on the manufacturing floor (often manually), by batch-manufacturing procedures. The precise alignment needed for high-performance modules will be accomplished automatically in the field under electronic servo control. The work represents a joint effort between the optoelectronics group and the sensors and actuators group at the University of California at Berkeley. The goals of this projects are: (1) development of silicon surface-micromachined technology for fabrication of alignment structures which possess the motion range, accuracy, and optical properties needed for adaptive optoelectronic packaging; (2) rigorous testing of these structures in regard to their optical properties, mechanical integrity, and environmental robustness; (3) demonstration of a simple optoelectronic module, specifically a pigtailed laser module, as a tool investigate issues related to adaptive packaging; (4) demonstration of high-performance, high-functionality optical subsystem, namely, a continuously-tunable narrow -linewidth external-cavity diode-laser, for investigation of the ultimate potential and limits of adaptive optoelectronic packaging. Successful development of this technology will lead to a great reduction in production costs of sophisticated and high-functionality optoelect ronic components and subsystems, presently available only as high cost, and sometimes laboratory-bound, bench-top instruments. This development is essential in order for optical and optoelectronic systems to make wide and lasting impact on the communication and computing infrastructures. ***