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International Postdoctoral Fellows: Micromechanics of Ferroelectric Material and Electronic Packaging

国际博士后研究员：铁电材料微力学与电子封装

基本信息

批准号：
9423964
负责人：
YongGang Huang
金额：
$ 1.76万
依托单位：
Individual Award
依托单位国家：
美国
项目类别：
Fixed Amount Award
财政年份：
1995
资助国家：
美国
起止时间：
1995-09-01 至 1998-09-30
项目状态：
已结题

来源：
https://www.nsf.gov/awardsearch/showAward?AWD_ID=9423964&HistoricalAwards=false
关键词：
International Postdoctoral Fellows Micromechanics Ferroelectric

项目摘要

9423964 Huang The International Junior Investigator and Postdoctoral Fellows Program enables U.S. scientists and engineers to conduct three to twenty-four months of research abroad. The program's awards provide opportunities for joint research, and the use of unique or complementary facilities, expertise and experimental conditions abroad. This award will support a five-month postdoctoral research visit by Dr. Yonggang Young Huang to work with Drs. Wei Yang and Keh-Chih Hwang of Tsinghua University in the People's Republic of China. Funding for this project will come from the East Asia-Pacific Program. This collaboration between Dr. Huang and Tsinghua University is designed to increase our fundamental understanding of micromechanics issues in electronic packaging and in constitutive modeling of "intelligent materials," plus advance the optimum design of reliable electronic packaging. The specific objectives of the project are: 1) To study the failure mechanisms of conductive adhesives over the full temperature range, with emphasis on highly constrained failure; 2) To study the interface degradation mechanisms of conductive adhesives due to thermal fatigue, with emphasis on defect evolution under thermal cycling; and 3) To model ferroelectric materials, with special focus on the relation between microscale phenomena and macroscopic properties. ***

小行星9423964 国际初级研究员和博士后研究员计划使美国科学家和工程师能够在国外进行三到二十四个月的研究。该计划的奖项提供了联合研究的机会，以及使用国外独特或互补的设施，专业知识和实验条件。该奖项将支持Yonggang Young Huang博士在中华人民共和国与清华大学的Wei Yang和Keh-Chih Hwang博士进行为期五个月的博士后研究访问。该项目的资金将来自东亚太平洋计划。黄博士与清华大学的合作旨在增加我们对电子封装和“智能材料”本构建模中微观力学问题的基本理解，并推进可靠电子封装的优化设计。该项目的具体目标是：1）研究导电胶在整个温度范围内的失效机理，重点是高度约束失效; 2）研究导电胶由于热疲劳引起的界面退化机理，重点是热循环下的缺陷演化;（3）建立铁电材料的模型，特别关注微观现象与宏观性质之间的关系。***