Solvent Free Liquid Photoresist

这个小企业创新研究第一阶段项目提出了一种新型液体光刻胶化学来生产印刷电路板（pcb）。这种化学性质允许100%固体应用，消除了目前可用光刻胶应用中使用的令人反感的溶剂。这种创新的化学方法使用了一种被活性成分阻断的硬化剂。该硬化剂与合适的单体、含酸（COOH）功能的低聚物、聚合物结合剂、光引发剂和光敏剂结合。涂层后，将材料加热以解离阻塞的硬化剂，导致反应成分的部分交联，形成无粘着（b级）表面。该涂层可以用紫外线图案化，紫外线通过自由基光反应导致涂层的选择性聚合。未暴露的材料是用碳酸钠或碳酸钾水溶液冲洗的。然后，图案化的光刻胶用于定义负像，以供随后的蚀刻、电镀和电镀。光刻胶随后在108钠或碳酸钾水溶液中剥离。该计划将通过在商业印刷电路板供应商的实际电路板基板上演示该材料来演示该方法的可行性。

This Small Business Innovation Research Phase I project proposes a novel liquid photoresist chemistry to produce printed circuit boards (PCBs). This chemistry permits 100% solids application, eliminating objectionable solvents used in the application of currently available photoresists. The innovative chemistry uses a hardener blocked with a reactive component. This hardener is combined with suitable monomers, oligomers containing acid (COOH) functionality, polymeric binders, photoinitiators and photosensitizers. Following coating the material is heated to dissociate the blocked hardener, resulting in a partial cross linking of the reactive component, forming a tack-free (B-Stage) surface. The coating is patternable with U.V. light which through a free radical photoreaction results in selective polymerization of the coating. The unexposed material is developed with a 18 sodium or potassium carbonate water solution. The patterned photoresist is then used to define the negative image for subsequent etching, plating and electroplating. The photoresist is subsequently removed by stripping in a 108 sodium or potassium carbonate water solution. This program will demonstrate the feasibility of this approach by demonstrating this material on real circuit board substrate at a commercial printed circuit board vendor.