Advanced Packaging Processes for Optoelectronic Component and System Manufacturing

这个小企业创新研究第一阶段项目解决了光电（OE）产品制造中对先进封装技术的需求。今天通信和计算方面的限制来自集中式串行架构的使用。通信和计算网络的未来将从集中式和串行系统转向分布式和并行系统。在高带宽并行I/O和处理器中使用电信号有几个限制：(1)费用和屏蔽电缆的体积；(2)衰减高；(3)串扰;(4)时序倾斜；(5)接地回路。因此，需求是对并行光和混合处理器以及并行光纤链路的光带宽的完全访问。目前，光电元件和系统发展的一个障碍是成本。包装占OE组件成本的40-50%。今天，定制包装是OE组件的规则，而不是例外。对灵活、标准化、低成本的包装技术的需求是巨大的。Photonics Research Incorporated提议为OE组件和系统开发先进的封装技术。

This Small Business Innovation Research Phase I project addresses the need for advanced packaging techniques in optoelectronic (OE) product manufacturing. The limitations in communication and computation today arise from the use of centralized, serial architectures. The future in communication and computation networks is to move away from systems which are centralized and serial to ones that are distributed and parallel. Using electrical signals for high-bandwidth parallel I/O and processors suffers from several limitations: (1) expense and bulk of shield cables; (2) high attenuation; (3) crosstalk; (4) timing skew; and (5) ground loops. Consequently, the demand is for full access to optical bandwidths for parallel optical and hybrid processors and parallel fiber links. Currently, one barrier to the development of optoelectronic (OE) components and systems is the cost. Packaging comprises 40-50% of the OE component cost. Today, custom packaging is the rule and not the exception for OE components. The need for flexible, standardized, low-cost packaging techniques is tremendous. Photonics Research Incorporated proposes to develop advanced packaging techniques for OE components and systems.