Advanced Packaging Processes for Optoelectronic Component and System Manufacturing

用于光电元件和系统制造的先进封装工艺

• 批准号: 9461460
• 负责人: Winston Fu
• 金额: $ 6.49万
• 依托单位: Photonics Research Incorporated
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1995
• 资助国家: 美国
• 起止时间: 1995-01-01 至 1995-10-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9461460&HistoricalAwards=false
• 关键词: Advanced; Packaging; Processes; Optoelectronic; Component

This Small Business Innovation Research Phase I project addresses the need for advanced packaging techniques in optoelectronic (OE) product manufacturing. The limitations in communication and computation today arise from the use of centralized, serial architectures. The future in communication and computation networks is to move away from systems which are centralized and serial to ones that are distributed and parallel. Using electrical signals for high-bandwidth parallel I/O and processors suffers from several limitations: (1) expense and bulk of shield cables; (2) high attenuation; (3) crosstalk; (4) timing skew; and (5) ground loops. Consequently, the demand is for full access to optical bandwidths for parallel optical and hybrid processors and parallel fiber links. Currently, one barrier to the development of optoelectronic (OE) components and systems is the cost. Packaging comprises 40-50% of the OE component cost. Today, custom packaging is the rule and not the exception for OE components. The need for flexible, standardized, low-cost packaging techniques is tremendous. Photonics Research Incorporated proposes to develop advanced packaging techniques for OE components and systems.

这个小型企业创新研究第一阶段项目解决了光电（OE）产品制造中对先进封装技术的需求。当今通信和计算的局限性源于集中式串行架构的使用。通信和计算网络的未来是从集中式和串行系统转向分布式和并行系统。将电信号用于高带宽并行I/O和处理器受到几个限制：（1）屏蔽电缆的费用和体积;（2）高衰减;（3）串扰;（4）定时偏斜;以及（5）接地回路。因此，对于并行光学和混合处理器以及并行光纤链路的光学带宽的完全访问的需求。目前，光电（OE）组件和系统开发的一个障碍是成本。封装占OE组件成本的40-50%。如今，定制封装已成为OE组件的常规，而不是例外。对灵活、标准化、低成本的包装技术的需求是巨大的。Photonics Research Incorporated建议为OE组件和系统开发先进的封装技术。