Undergraduate Laboratory for Teaching Heat Transfer via Thermal Behavior of Electronics
Undergraduate Laboratory for Teaching Heat Transfer via Thermal Behavior of Electronics
批准号:
9552005
负责人:
Kirk Hagen
金额:
$1.08万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
1995
资助国家:
美国
项目状态:
已结题
起止时间:
1995-10-01 至 1998-09-30
中文摘要
该项目建立了一个本科实验室,利用电子学的热行为作为教授传热学基础的一种手段。使用模拟或模拟电子元件和系统的实际热特性的设备来教授基本的传热学原理。该实验室支持该大学机械工程技术专业的传热学必修课。实验室在热力学、流体力学和电子学课程中的辅助使用也得到支持。由于对计算能力和实时通信的要求推动了电子封装密度的急剧增加,电子产品的热控制已成为一项关键技术。这项技术引发的传热学教育的程度和专业性对当今的技术毕业生提出了独特的要求。该项目通过向工程技术专业的学生介绍电子设备的热控技术来帮助满足这些需求。由于电子热工程已被确定为美国经济竞争力的关键技术,该项目有可能产生重大影响。
英文摘要
This project establishes an undergraduate laboratory in which the thermal behavior of electronics is used as a means of teaching the fundamentals of heat transfer. Essential heat transfer principles are taught using apparatuses that model or simulate actual thermal characteristics of electronic components and systems. This laboratory supports a heat transfer course required of Mechanical Engineering Technology majors at the university. Ancillary uses of the laboratory in thermodynamics, fluid mechanics, and electronics courses are also supported. As a result of the dramatic increase of electronic packaging densities driven by requirements for more computing power and real-time communications, thermal control of electronics has become a critical technology. The degree and specificity of heat transfer education invoked by this technology pose unique demands on today's technology graduates. This project helps satisfy those demands by introducing engineering technology students to thermal control techniques for electronic equipment. Because thermal engineering of electronics has been identified as a critical technology for the economic competitiveness of the United States, this project has the potential of having a significant impact.
期刊论文(0)
专著(0)
科研奖励(0)
会议论文
海外基金