SBIR PHASE I: Plasma Deposition of Organic Antireflective Coatings

SBIR 第一阶段：有机抗反射涂层的等离子沉积

• 批准号: 9560957
• 负责人: Tony Flaim
• 金额: $ 7.5万
• 依托单位: Brewer Science, Inc.
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 1996
• 资助国家: 美国
• 起止时间: 1996-04-01 至 1997-03-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9560957&HistoricalAwards=false
• 关键词: SBIR; PHASE; Plasma; Deposition; Organic

This Small Business Innovation Research Phase I Project will investigate plasma polymerization as an alternative to spin coating of organic anti- reflective coatings (ARCs). In this method, the ARC will be formed directly on the substrate to alleviate the problems associated with spin coating. Phase I will focus on achieving defect-free, highly conformal coatings on semiconductor substrates using existing plasma-depositable polymer materials and processes. IC manufacturers have consistently pursued the use of larger wafer sizes and smaller device features to improve product yield, reduce unit cost, and increase on-chip computing power. Reducing substrate reflectivity to less than 1% during photoresist exposure will be critical for maintaining dimensional control at these feature sizes. Spin coated ARCs offer excellent reflectivity control but are limited by uniformity, defectivity, and conformality problems stemming form the spin coating process. The long term goal of this work is to introduce a turn-key ARC product package containing: (1) a dedicated deposition tool, (2) a set of plasma-depositable polymer materials designed specifically for ARC applications, and, (3) processes for depositing organic ARCs on a variety of key device structures. The availability of high performance organic ARCs is critical for the successful implementation of deep UV(248 and 193 nm) microlithographic processes by U.S. and foreign chip makers over the next 10 years. The international market for deep UV ARC materials is estimated to grow to $25 MM by 2005. The proposed effort will build a technology platform for assuring the availability of organic ARC processes after the usefulness of spin coated ARCs has been surpassed.

这个小企业创新研究第一阶段项目将研究等离子体聚合作为有机抗反射涂层（ARC）旋涂的替代方案。在这种方法中，ARC将直接形成在基板上，以减轻与旋涂相关的问题。第一阶段的重点是利用现有的等离子体沉积聚合物材料和工艺在半导体基底上实现无缺陷、高度保形的涂层。 IC制造商一直追求使用更大的晶片尺寸和更小的器件特征来提高产品良率、降低单位成本并增加片上计算能力。在光致抗蚀剂曝光期间将衬底反射率降低到小于1%对于在这些特征尺寸下保持尺寸控制将是至关重要的。旋涂ARC提供优异的反射率控制，但受到源自旋涂工艺的均匀性、缺陷性和保形性问题的限制。 这项工作的长期目标是介绍一个交钥匙ARC产品包，包含：（1）专用的沉积工具，（2）一套等离子体沉积聚合物材料，专门为ARC应用设计，和（3）在各种关键器件结构上沉积有机ARC的过程。 高性能有机ARC的可用性对于美国和外国芯片制造商在未来10年内成功实施深紫外（248和193 nm）微光刻工艺至关重要。据估计，到2005年，深紫外ARC材料的国际市场将增长到2500万美元。拟议的努力将建立一个技术平台，以确保有机ARC工艺的可用性后，旋涂ARC的有用性已被超越。