SBIR PHASE I: Imaging Ellipsometry for Semiconductor Wafer Mapping

这个小型企业创新研究第一阶段项目将确定和展示椭偏测绘仪器的新想法和设计，该仪器将应用于半导体晶圆和平板显示器的加工控制。传统的基于点测量的椭偏仪被广泛用于半导体薄膜厚度和介电常数的表征。然而，在半导体工艺控制中，通过椭偏测量法进行快速在线晶圆映射是不现实的。如果这一想法和设计得到验证，将产生新一代椭圆偏振测量仪器，这种仪器具有无损、快速在线测绘、适用于任何大尺寸半导体晶片或平板显示器的特点，将是半导体仪器市场的一次突破。

This Small Business Innovation Research Phase I Project will identify and demonstrate a new idea and design for an ellipsometry mapping instrument, which will be applied to processing control of semiconductor wafers and flat panel displays. The conventional point-measurement-based ellipsometry is widely used for semiconductor thin film thickness and dielectric constant characterization. However, fast in-line wafer mapping by ellipsometry, which should be desirable in semiconductor processing control, has been impractical. This proposed idea and design, if proved, will produce a new generation of ellipsometry instrumentation, which is non-destructive, fast for in-line mapping, suitable for any large size semiconductor wafers or flat panel displays, and will be a breakthrough in the semiconductor instrumentation market.