A Career Development Plan for Research and Education Based on Joining of Intermetallic Compounds

9623599 Gale这个职业计划的重点是与金属间化合物与传统镍基高温合金连接密切相关的教育活动的研究。瞬态液相（TLP）键合作为一种键合结构金属间化合物的技术被研究，因为它能容忍这种合金体系通常表现出的有限的低温延展性和稳定的氧化物形成。本研究旨在阐明控制镍铝/高温合金接头加工组织性能关系的机制，从而为改进组织控制提供途径。制定合适的过程建模工具是研究的重要组成部分。学生经常遇到的一个困难是根据科学的不同方面之间共享和联系的概念建立相互联系。该计划的教育部分开发了金属间合金到高温合金连接的教育模块，说明了材料科学的关键方面，适当强调微观结构发展，材料加工，机械性能，动力学和热力学。本单元将包括多媒体教学资源和课堂演示。金属间化合物领域是美国和世界范围内的一项主要研究活动。初始制造和后期维修需要合适的方法。金属间化合物与常规材料（如高温合金）的结合尤其重要，因为金属间化合物很可能在主要由这类材料组成的工程系统中局部使用。＊＊＊

9623599 Gale This CAREER program focuses on research with closely linked educational activities related to joining of intermetallic compounds to conventional nickel-base superalloys. Transient liquid phase (TLP) bonding is examined as a technique for bonding structural intermetallics since it is tolerant of limited low temperature ductility and stable oxide formation often exhibited by such alloy systems. The research aims to elucidate the mechanisms controlling processing structure property relationships in nickel aluminide/superalloy joints and thereby demonstrate routes for improved microstructural control. The formulation of suitable process modeling tools are a vital part of the research. A difficulty often encountered by students is establishing interconnections in terms of shared and linked concepts between different aspects of science. The educational part of the program develops an educational module on intermetallic alloy to superalloy joining that illustrates key aspects of materials science with appropriate emphasis on microstructural development, materials processing, mechanical properties, kinetics and thermodynamics. This module will include multimedia teaching resources and inclass demonstrations. %%% The field of intermetallic compounds constitutes a major research activity both within the US and worldwide. Suitable methodologies are needed for initial fabrication and post service repair. The joining of intermetallics to conventional materials, such as superalloys, is particularly important as intermetallics are likely to be used locally within engineering systems composed predominantly of such materials. ***