A Career Development Plan for Research and Education Based on Joining of Intermetallic Compounds
A Career Development Plan for Research and Education Based on Joining of Intermetallic Compounds
批准号:
9623599
负责人:
William Gale
金额:
$20.0万
依托单位:
依托单位国家:
美国
项目类别:
Continuing Grant
财政年份:
1996
资助国家:
美国
项目状态:
已结题
起止时间:
1996-07-01 至 2001-06-30
中文摘要
9623599盖尔这一职业计划的重点是与金属间化合物与传统镍基高温合金连接相关的密切相关的教育活动的研究。瞬间液相连接(TLP)作为一种连接结构金属间化合物的技术被认为是一种用于连接结构金属间化合物的技术,因为它可以承受有限的低温塑性和这类合金系统经常表现出的稳定氧化物形成。本研究旨在阐明镍铝化物/高温合金接头工艺组织性能关系的控制机制,从而为改善组织控制提供途径。制定合适的过程建模工具是研究的重要部分。学生经常遇到的一个困难是在科学的不同方面之间建立相互联系的共享和联系的概念。该计划的教育部分开发了关于金属间合金与高温合金连接的教育模块,说明了材料科学的关键方面,适当强调了微观结构发展、材料加工、机械性能、动力学和热力学。本单元将包括多媒体教学资源和课堂演示。金属间化合物领域是美国和世界范围内的一项主要研究活动。初始制造和服务后维修需要适当的方法。金属间化合物与高温合金等传统材料的连接特别重要,因为金属间化合物很可能在主要由此类材料组成的工程系统中局部使用。***
英文摘要
9623599 Gale This CAREER program focuses on research with closely linked educational activities related to joining of intermetallic compounds to conventional nickel-base superalloys. Transient liquid phase (TLP) bonding is examined as a technique for bonding structural intermetallics since it is tolerant of limited low temperature ductility and stable oxide formation often exhibited by such alloy systems. The research aims to elucidate the mechanisms controlling processing structure property relationships in nickel aluminide/superalloy joints and thereby demonstrate routes for improved microstructural control. The formulation of suitable process modeling tools are a vital part of the research. A difficulty often encountered by students is establishing interconnections in terms of shared and linked concepts between different aspects of science. The educational part of the program develops an educational module on intermetallic alloy to superalloy joining that illustrates key aspects of materials science with appropriate emphasis on microstructural development, materials processing, mechanical properties, kinetics and thermodynamics. This module will include multimedia teaching resources and inclass demonstrations. %%% The field of intermetallic compounds constitutes a major research activity both within the US and worldwide. Suitable methodologies are needed for initial fabrication and post service repair. The joining of intermetallics to conventional materials, such as superalloys, is particularly important as intermetallics are likely to be used locally within engineering systems composed predominantly of such materials. ***
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